LFE2-50SE-6FN484I

The LFE2-50SE-6FN484I is an ECP2 family field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a balance of logic capacity, on-chip memory and I/O density in a 484-ball BGA package suitable for industrial applications.

With 48,000 logic elements, approximately 0.396 Mbits of embedded memory and 339 I/O pins, this device targets designs that require significant programmable logic, substantial I/O connectivity and operation across an industrial temperature range.

Key Features

• Logic Capacity — 48,000 logic elements provide programmable fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 0.396 Mbits (396,288 bits) of on-chip RAM for data buffering, FIFOs and state storage.
• I/O Density — 339 I/O pins support large peripheral sets, multi-channel interfaces or rich board-level connectivity.
• Power Supply — Operates from a 1.14 V to 1.26 V core supply range to match system power-rail requirements.
• Package — 484-ball BGA (484-FPBGA, 23×23) in a 484-BBGA package case for compact board integration and high pin count routing.
• Mounting & Compliance — Surface-mount device with RoHS compliance for modern PCB assembly and regulatory requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental conditions.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating, abundant I/O and programmable logic for control electronics, motor drives and automation interfaces.
• Communications and Interfaces — High I/O count and embedded memory support protocol bridging, interface aggregation and custom transceiver glue logic.
• Embedded Systems — Implement custom peripherals, accelerators and system glue logic where sizable logic capacity and on-chip RAM are required.

Unique Advantages

• Substantial Logic Resources: 48,000 logic elements enable integration of multiple functions onto a single FPGA, reducing board-level component count.
• On-Chip Memory: Approximately 0.396 Mbits of RAM provides local buffering and state retention to streamline data-path and control implementations.
• High I/O Count: 339 I/Os accommodate complex external connectivity and multi-channel interfacing without additional multiplexing logic.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployment in demanding ambient environments.
• Compact, High-Pin Package: 484-ball BGA (23×23) offers a high-density footprint for space-constrained designs while enabling robust signal routing.
• Regulatory Compliance: RoHS-compliant construction supports contemporary assembly and environmental requirements.

Why Choose LFE2-50SE-6FN484I?

The LFE2-50SE-6FN484I positions itself as a capable mid-to-high density FPGA option that combines sizable programmable logic, measurable on-chip memory and a high I/O count in a compact BGA package. Its industrial temperature rating and surface-mount form factor make it suitable for designs that require both robustness and integration.

This device is well suited for engineers building industrial embedded systems, communication interface modules and custom logic subsystems that need scalable logic resources, local RAM and broad connectivity while maintaining compliance with RoHS standards.

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