LFE2-50SE-5FN672C

The LFE2-50SE-5FN672C is a Lattice ECP2 family field-programmable gate array (FPGA) in a 672-ball BBGA package optimized for high-density digital integration. It delivers approximately 48,000 logic elements, approximately 396,288 bits of on-chip embedded memory, and up to 500 I/Os, making it suitable for interface-rich embedded systems and signal-processing applications that require large I/O capacity and on-chip memory.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 1.14 V to 1.26 V supply and supports an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and packaged in a 672-ball FPBGA (27 × 27 mm) footprint.

Key Features

• Core Logic  Approximately 48,000 logic elements (LUT-based resources) for high logic density and integration of complex digital functions.
• Embedded Memory  Approximately 396,288 bits of on-chip embedded memory for buffering, packet storage, and local data retention.
• DSP Resources  Family-level sysDSP resources (ECP2-50 family) provide dedicated multiply-accumulate capability and multiplier fabric for signal processing workloads.
• I/O Capacity & Flexibility  Up to 500 I/Os to support broad external connectivity; programmable I/O buffers support a wide range of interface standards documented for the family.
• Clocking  On-chip clock management resources (GPLLs, SPLLs and DLLs as provided in the ECP2 family) to enable clock multiply, divide and phase/delay adjustments.
• Package & Mounting  672-ball BBGA (27 × 27 mm) surface-mount package (supplier device package: 672-FPBGA), facilitating compact board-level integration.
• Power & Operating Range  Low-voltage core operation with a supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for lead-free assembly and environmental regulatory alignment.

Typical Applications

• High-density embedded systems  Integrate complex control and processing logic where large logic capacity and significant on-chip memory are required.
• Communications and networking equipment  Implement protocol bridging, packet buffering and interface aggregation leveraging the device's high I/O count and embedded memory.
• Digital signal processing  Apply built-in DSP capabilities and multipliers for filtering, aggregation and real-time data processing tasks.
• Custom interface and I/O expansion  Use the extensive I/O resources to adapt legacy interfaces or add custom parallel/serial I/O to host systems.

Unique Advantages

• High logic density: Approximately 48,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board area.
• Large on-chip memory: Approximately 396,288 bits of embedded memory supports packet buffering, frame storage and local state tables without external SRAM.
• Extensive I/O resources: Up to 500 I/Os provide flexibility to interface with many peripherals and connectors directly from the FPGA.
• Compact, industry-standard package: 672-ball FPBGA (27 × 27 mm) allows dense population and compatibility with modern PCB layouts.
• Commercial-grade operating range: 0 °C to 85 °C and RoHS compliance for mainstream electronics manufacturing and deployment.
• Part of the Lattice ECP2 family: Access to family-level features and design flows optimized for integration and system-level implementation.

Why Choose LFE2-50SE-5FN672C?

The LFE2-50SE-5FN672C positions itself as a high-density, I/O-rich FPGA for designers needing substantial logic capacity, embedded memory, and flexible interfacing in a compact BGA footprint. Its feature set supports integration of control, signal processing and interface functions into a single device for shortened BOM and simplified system architecture.

Because it is part of the Lattice ECP2 family, the device aligns with established design flows and family-level resources, offering a clear upgrade path within the family for scalable designs. The combination of logic, memory and I/O makes this device a practical choice for embedded system designers, communications equipment OEMs and developers of DSP-accelerated functions.

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