LFE2-50SE-5FN484I

The LFE2-50SE-5FN484I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It combines a high logic element count, substantial embedded memory, and a large I/O complement in a compact surface-mount 484-ball BGA package.

This device targets designs that require reconfigurable logic, significant on-chip memory for buffering or state storage, and broad external connectivity while operating across an industrial temperature range.

Key Features

• Core Logic — 48,000 logic elements implemented across 6,000 configurable logic blocks (CLBs), providing a substantial fabric for custom digital functions.
• Embedded Memory — Approximately 0.396 Mbits (396,288 bits) of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Density — 339 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
• Package & Mounting — 484-ball FBGA package (23 × 23 mm footprint) in a 484-BBGA package case, optimized for surface-mount assembly.
• Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V for the FPGA core.
• Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployments in demanding environments.
• Compliance — RoHS‑compliant component suitable for lead‑free production processes.

Typical Applications

• Industrial Control Systems — Reconfigurable logic for motor control, PLC functions, and process automation where industrial temperature range and high I/O counts are required.
• Custom I/O and Interface Bridging — High I/O density enables complex interface aggregation and protocol bridging on a single device.
• Embedded Processing and Acceleration — On-chip RAM and abundant logic elements support application-specific accelerators and data-path implementations.
• High-Density Board Designs — Compact 484-BBGA package and surface-mount mounting support space-constrained, high-performance PCB layouts.

Unique Advantages

• High Logic Capacity: 48,000 logic elements provide the resource headroom for complex, integrated digital designs without immediately requiring multi-chip solutions.
• Significant Embedded Memory: Approximately 0.396 Mbits of on-chip RAM reduces dependence on external memory for buffering and latency-sensitive data handling.
• Extensive I/O Options: 339 I/Os enable connection to many peripherals and external devices directly from a single FPGA footprint.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet environmental demands of industrial deployments.
• Compact, Surface-Mount Package: 484-ball FBGA (23 × 23 mm) balances pin count and PCB area for dense system integration.
• Low-Voltage Core Operation: 1.14 V to 1.26 V core supply supports efficient power budgeting in modern designs.

Why Choose LFE2-50SE-5FN484I?

The LFE2-50SE-5FN484I positions itself as an industrial-grade FPGA option that combines dense logic resources, a useful amount of embedded RAM, and broad I/O capability in a compact BGA package. Its operating range and RoHS compliance make it suitable for industrial and other temperature-demanding applications.

This device is well suited to engineering teams building reconfigurable, high-I/O systems that require on-board memory and a compact surface-mount solution. The combination of resources supports iterative development and field-updatable hardware functionality while fitting into space-constrained PCB designs.

If you would like pricing, availability, or a formal quote for the LFE2-50SE-5FN484I, please submit a request or contact our sales team to receive a personalized quote and technical assistance.