LFE2-50SE-5F672C

The LFE2-50SE-5F672C is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines substantial programmable logic capacity and a high I/O count in a compact 672-ball BGA package for commercial embedded designs.

With 48,000 logic elements, approximately 0.396 Mbits of embedded memory and up to 500 I/O pins, this device is suited to designs that require dense I/O connectivity and significant on-chip logic and memory resources while operating within standard commercial temperature and supply ranges.

Key Features

• Programmable Logic  48,000 logic elements provide a substantial resource pool for implementing custom logic, protocol handling, and hardware acceleration within the FPGA.
• On-chip Memory  Approximately 0.396 Mbits of embedded RAM (396,288 bits) for buffering, FIFOs, and small lookup tables directly within the device.
• I/O Capacity  Up to 500 I/O pins support high-density interfacing to external devices, sensors, and parallel or serial buses.
• Power  Operates from a core supply range of 1.14 V to 1.26 V, enabling predictable integration into power-managed systems.
• Package and Mounting  Supplied in a 672-ball BGA package (672-FPBGA, 27 × 27) designed for surface-mount assembly to save board area while delivering high pin count.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation and RoHS-compliant construction for environmentally conscious designs.

Typical Applications

• High-density I/O systems  Use the 500 I/O pins to interface directly to multiple peripherals, parallel buses, or arrayed sensors.
• Embedded hardware acceleration  Leverage 48,000 logic elements for offloading compute-intensive tasks and implementing custom datapaths.
• On-board buffering and logic  Employ the embedded RAM for local buffering, FIFOs, and small memory-backed functions within mixed-signal or digital designs.

Unique Advantages

• High logic capacity: 48,000 logic elements enable complex logic implementations without external glue logic.
• Large I/O complement: 500 I/O pins reduce the need for external multiplexers or expanders, simplifying board-level design.
• On-chip memory resources: Approximately 0.396 Mbits of embedded RAM supports local buffering and state storage, improving data throughput.
• Space-efficient package: 672-ball BGA (27 × 27) provides a compact footprint for high-pin-count requirements.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial product deployments.

Why Choose LFE2-50SE-5F672C?

The LFE2-50SE-5F672C positions itself as a mid-range ECP2 FPGA option offering a balance of large logic resources, embedded memory, and a very high I/O count in a compact BGA package. It is tailored for commercial embedded designs that need substantial programmable logic and dense external connectivity without expanding PCB area.

For engineers and procurement teams building scalable, board-level systems that require on-chip logic, memory, and abundant I/O, this device delivers predictable supply and thermal ranges along with RoHS compliance to support mainstream commercial product development.

Request a quote or submit a product inquiry today to begin specifying the LFE2-50SE-5F672C into your next design.