LFE2-50E-7FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA |
|---|---|
| Quantity | 123 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 339 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFE2-50E-7FN484C – ECP2 FPGA, 48K logic elements, 339 I/Os, 484-BBGA
The LFE2-50E-7FN484C is a Lattice ECP2 family field programmable gate array (FPGA) in a 484-ball fpBGA package. It combines a high logic element count with substantial I/O and embedded memory to serve a range of commercial embedded and system-integration designs.
Designed for applications that require programmable logic, on-chip memory and flexible I/O, this device delivers integration and configurability while operating from a 1.14 V to 1.26 V supply and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core logic — 48,000 logic elements and 6,000 CLBs provide extensive LUT-based logic resources for implementing complex digital functions and control logic.
- Embedded memory — Approximately 0.40 Mbits of on-chip RAM (396,288 total bits) for data buffering, state storage and local scratch memory.
- sysDSP and arithmetic — ECP2-50 family allocation includes 18 sysDSP blocks with support for multiple multiplier widths (family-level capability), enabling high-performance multiply-accumulate operations in hardware.
- I/O capacity and flexibility — 339 user I/Os provided in the 484-ball fpBGA footprint; programmable I/O buffer features in the ECP2 family support a wide range of signaling standards for interface flexibility.
- Clocking resources — Family-level PLL/DLL resources (GPLLs, SPLLs and DLLs) enable clock multiplication, division and phase/delay adjustment for system timing requirements.
- Power and thermal — Low-voltage core operation (1.14 V to 1.26 V) and surface-mount 484-BBGA package (484-FPBGA, 23 × 23 mm) suited to compact board layouts; commercial grade operation from 0 °C to 85 °C.
- Compliance — RoHS compliant construction for environmental compliance.
Typical Applications
- High-density control and glue logic — Use the 48,000 logic elements to consolidate multiple discrete controllers or bridge complex peripheral buses in compact system designs.
- Signal processing and acceleration — sysDSP blocks and on-chip memory enable hardware-accelerated filtering, data aggregation and real-time arithmetic tasks.
- Interface and protocol bridging — Large I/O count and programmable I/O support make the device well suited for protocol translation, board-level bridging and multi-standard interface hubs.
- Memory controller and buffering — Embedded RAM provides local buffering and temporary storage for memory controller implementations and data path staging.
Unique Advantages
- High integration density: 48,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board area.
- Ample I/O headroom: 339 I/Os support extensive peripheral and bus connectivity without immediate need for external I/O expanders.
- On-chip memory for latency-sensitive data: Approximately 0.40 Mbits of embedded RAM supports buffering and state retention close to logic, improving throughput for data paths.
- Dedicated DSP resources: sysDSP blocks on the ECP2-50 family enable efficient implementation of multiply-accumulate and signal-processing kernels in hardware.
- Compact, board-friendly package: 484-ball fpBGA (23 × 23 mm) surface-mount package balances pin count and PCB footprint for dense designs.
- Environmentally compliant: RoHS compliance supports regulatory requirements and manufacturing practices.
Why Choose LFE2-50E-7FN484C?
The LFE2-50E-7FN484C positions itself as a programmable, high-density logic solution for commercial embedded systems that require a balance of logic resources, on-chip memory and extensive I/O. Its ECP2-family capabilities such as sysDSP blocks and flexible clocking resources make it suitable for designers implementing signal processing, interface bridging and tightly integrated control functions.
For teams building compact, board-level systems that need scalable logic, abundant I/O and programmable memory resources, this FPGA offers a practical combination of integration and configurability, backed by the established ECP2 family architecture.
Request a quote or submit a procurement inquiry to receive pricing and availability for LFE2-50E-7FN484C.

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