LFE2-50E-7FN484C

IC FPGA 339 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 339 396288 48000 484-BBGA

Quantity 123 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O339Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFE2-50E-7FN484C – ECP2 FPGA, 48K logic elements, 339 I/Os, 484-BBGA

The LFE2-50E-7FN484C is a Lattice ECP2 family field programmable gate array (FPGA) in a 484-ball fpBGA package. It combines a high logic element count with substantial I/O and embedded memory to serve a range of commercial embedded and system-integration designs.

Designed for applications that require programmable logic, on-chip memory and flexible I/O, this device delivers integration and configurability while operating from a 1.14 V to 1.26 V supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Core logic — 48,000 logic elements and 6,000 CLBs provide extensive LUT-based logic resources for implementing complex digital functions and control logic.
  • Embedded memory — Approximately 0.40 Mbits of on-chip RAM (396,288 total bits) for data buffering, state storage and local scratch memory.
  • sysDSP and arithmetic — ECP2-50 family allocation includes 18 sysDSP blocks with support for multiple multiplier widths (family-level capability), enabling high-performance multiply-accumulate operations in hardware.
  • I/O capacity and flexibility — 339 user I/Os provided in the 484-ball fpBGA footprint; programmable I/O buffer features in the ECP2 family support a wide range of signaling standards for interface flexibility.
  • Clocking resources — Family-level PLL/DLL resources (GPLLs, SPLLs and DLLs) enable clock multiplication, division and phase/delay adjustment for system timing requirements.
  • Power and thermal — Low-voltage core operation (1.14 V to 1.26 V) and surface-mount 484-BBGA package (484-FPBGA, 23 × 23 mm) suited to compact board layouts; commercial grade operation from 0 °C to 85 °C.
  • Compliance — RoHS compliant construction for environmental compliance.

Typical Applications

  • High-density control and glue logic — Use the 48,000 logic elements to consolidate multiple discrete controllers or bridge complex peripheral buses in compact system designs.
  • Signal processing and acceleration — sysDSP blocks and on-chip memory enable hardware-accelerated filtering, data aggregation and real-time arithmetic tasks.
  • Interface and protocol bridging — Large I/O count and programmable I/O support make the device well suited for protocol translation, board-level bridging and multi-standard interface hubs.
  • Memory controller and buffering — Embedded RAM provides local buffering and temporary storage for memory controller implementations and data path staging.

Unique Advantages

  • High integration density: 48,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board area.
  • Ample I/O headroom: 339 I/Os support extensive peripheral and bus connectivity without immediate need for external I/O expanders.
  • On-chip memory for latency-sensitive data: Approximately 0.40 Mbits of embedded RAM supports buffering and state retention close to logic, improving throughput for data paths.
  • Dedicated DSP resources: sysDSP blocks on the ECP2-50 family enable efficient implementation of multiply-accumulate and signal-processing kernels in hardware.
  • Compact, board-friendly package: 484-ball fpBGA (23 × 23 mm) surface-mount package balances pin count and PCB footprint for dense designs.
  • Environmentally compliant: RoHS compliance supports regulatory requirements and manufacturing practices.

Why Choose LFE2-50E-7FN484C?

The LFE2-50E-7FN484C positions itself as a programmable, high-density logic solution for commercial embedded systems that require a balance of logic resources, on-chip memory and extensive I/O. Its ECP2-family capabilities such as sysDSP blocks and flexible clocking resources make it suitable for designers implementing signal processing, interface bridging and tightly integrated control functions.

For teams building compact, board-level systems that need scalable logic, abundant I/O and programmable memory resources, this FPGA offers a practical combination of integration and configurability, backed by the established ECP2 family architecture.

Request a quote or submit a procurement inquiry to receive pricing and availability for LFE2-50E-7FN484C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up