LFE2-50E-6FN484C

The LFE2-50E-6FN484C is an ECP2 family Field Programmable Gate Array (FPGA) by Lattice Semiconductor Corporation, delivering a balance of logic density, embedded memory and I/O capacity in a compact ball-grid array package. Its architecture supports designs that require large numbers of logic elements, substantial on-chip RAM, and extensive external connectivity within a commercial-temperature envelope.

With 48,000 logic elements, approximately 0.396 Mbits of embedded memory and 339 I/O, this device targets applications needing dense programmable logic and high pin-count interfacing while operating from a 1.14 V to 1.26 V supply.

Key Features

• Logic Density  Approximately 48,000 logic elements with 6,000 logic blocks, enabling implementation of complex digital functions and mid-to-high complexity designs.
• Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (396,288 bits) for buffering, look-up tables and small data storage needs without external memory.
• I/O Capacity  339 I/O pins to support wide parallel interfaces, multiple buses or mixed-signal front-ends requiring numerous signal connections.
• Power and Voltage  Operates from a 1.14 V to 1.26 V supply range, suitable for modern low-voltage FPGA designs.
• Package & Mounting  484-ball BGA (484-BBGA / supplier package 484-FPBGA, 23×23) in a surface-mount format for space-efficient PCB integration.
• Operating and Compliance  Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Communications Equipment  Implement protocol handling, data buffering and custom packet processing where high logic count and many I/Os enable flexible interface support.
• Embedded Systems  Serve as a central programmable fabric for controllers and processing subsystems that require embedded RAM and a large number of peripheral connections.
• High‑Density I/O Designs  Ideal for applications that need to aggregate many signals — such as parallel sensor arrays or multi-channel interfaces — using the device's 339 I/O pins.
• Prototyping and Evaluation  Use the FPGA’s logic capacity and on-chip memory to validate custom logic, accelerate development cycles, and iterate designs before production.

Unique Advantages

• High Logic Capacity: 48,000 logic elements provide the headroom to implement complex state machines, datapaths and control logic within a single device.
• Substantial Embedded RAM: Approximately 0.396 Mbits of on-chip memory reduces dependence on external memory for many buffering and LUT requirements.
• Extensive I/O Count: 339 I/O pins support wide parallel interfaces and multiple peripheral connections, simplifying board-level routing for I/O‑heavy systems.
• Compact BGA Packaging: 484-ball BGA (23×23) delivers high pin density in a surface-mount footprint, helping conserve PCB area while maintaining connectivity.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range aligns with contemporary low-voltage digital systems to help manage power budgets.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production processes.

Why Choose LFE2-50E-6FN484C?

The LFE2-50E-6FN484C positions itself as a commercially graded FPGA that combines significant logic resources, embedded memory and a very high I/O count in a compact 484-ball BGA package. Its specifications make it well suited for engineers who need a programmable platform capable of handling mid-to-high complexity digital designs with extensive external interfacing requirements.

Choose this part when you need a scalable, single-device solution to consolidate logic, buffering and I/O into a compact footprint while maintaining commercial-temperature operation and RoHS compliance.

Request a quote or submit an inquiry today to check pricing and availability for the LFE2-50E-6FN484C.