LFE2-50E-6F672C

The LFE2-50E-6F672C is an ECP2 family Field Programmable Gate Array (FPGA) offered in a 672-ball BGA package. It combines a high count of logic elements, extensive on-chip memory, and broad I/O capacity for system-level integration in commercial embedded designs.

This device is suited for applications that require dense programmable logic, flexible I/O and on-chip RAM while operating at standard commercial temperature and voltage ranges.

Key Features

• Core Logic — 48,000 logic elements delivered in the ECP2 architecture for complex programmable logic implementations.
• Embedded Memory — Approximately 0.396 Mbits (396,288 bits) of on-chip RAM to support buffers, lookup tables and local storage.
• I/O Capacity — Up to 500 user I/Os, enabling wide parallel interfaces and board-level connectivity.
• sysDSP and Arithmetic Blocks — ECP2 family includes sysDSP blocks for high-performance multiply-accumulate operations (family-level feature).
• Clocking — Integrated PLLs and DLLs available in the ECP2 family for clock multiplication, division and phase/delay adjustment (family-level feature).
• Programmable I/O Standards — Support for a wide range of I/O standards within the family for interfacing to common logic families and source-synchronous interfaces (family-level capability).
• Configuration and Security — Flexible device configuration options are supported by the family, including SPI boot flash interfaces and dual-boot image capability (family-level feature).
• Power and Operating Range — Nominal core supply range from 1.14 V to 1.26 V; commercial operating temperature range of 0 °C to 85 °C.
• Package — 672-ball FPBGA (27 × 27 mm) package for compact board-level integration and high I/O density.
• RoHS Compliant — Device meets RoHS requirements for environmental compliance.

Typical Applications

• Embedded Systems — Implement custom control logic, peripheral interfaces and glue logic in compact embedded platforms.
• Digital Signal Processing — Use on-chip DSP resources and logic fabric for tailored signal processing and acceleration tasks.
• High‑I/O Control and Bridge Logic — Deploy as an interface hub or protocol translator where many parallel I/Os and configurable logic are needed.
• Memory Interface and Buffering — Leverage embedded RAM for local buffering, FIFOs and packet staging in data-handling designs.

Unique Advantages

• High Logic Density: 48,000 logic elements enable sophisticated designs without moving to larger device classes, reducing board-level redesign.
• Substantial On‑Chip Memory: Approximately 0.396 Mbits of embedded RAM supports local storage needs and reduces dependence on external memory.
• Large I/O Count: 500 I/Os provide flexibility for parallel interfaces, sensor arrays, and multi-channel connectivity.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, matching typical commercial embedded product requirements.
• Compact High‑Density Package: 672-ball FPBGA (27 × 27 mm) delivers high I/O in a compact footprint for space-constrained designs.
• Environmentally Compliant: RoHS compliance simplifies regulatory and manufacturing considerations.

Why Choose LFE2-50E-6F672C?

The LFE2-50E-6F672C positions itself as a high-density, commercially rated FPGA option that balances logic capacity, embedded memory and expansive I/O in a compact 672-ball BGA package. It is well suited for embedded and DSP-centric applications that need programmable flexibility without exceeding commercial operating ranges.

Designers benefit from a device that supports system-level integration—offering configurable I/O standards, on-chip memory for buffering, and family-supported DSP and clock resources—making it a practical choice for mid-range FPGA implementations where agility and board-level integration matter.

Request a quote or submit a procurement inquiry to obtain pricing, availability and lead‑time information for the LFE2-50E-6F672C.