LFE2-50E-5FN672I

The LFE2-50E-5FN672I is a field programmable gate array (FPGA) IC from Lattice Semiconductor designed for industrial-grade applications. It provides a programmable logic fabric with 48,000 logic elements, approximately 0.396 Mbits of embedded memory, and up to 500 I/O pins to support complex, high-density designs.

With a low-voltage core supply range and a 672-ball BGA package, this device is intended for compact, surface-mount system designs that require integrated I/O density, on-chip memory, and operation across extended temperature ranges.

Key Features

• Programmable Logic 48,000 logic elements to implement custom combinational and sequential logic functions for a wide range of designs.
• Embedded Memory Approximately 0.396 Mbits of on-chip RAM to support buffering, FIFOs, and small data-storage needs without external memory.
• High I/O Count Up to 500 general-purpose I/O pins for connecting sensors, peripherals, interfaces, and high-density system I/O requirements.
• Package & Mounting 672‑BBGA package (supplier device package: 672‑FPBGA, 27×27 mm) optimized for surface-mount assembly in space-constrained PCBs.
• Power Core voltage supply range of 1.14 V to 1.26 V for defined power delivery and integration with modern low-voltage power rails.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for designs that require extended temperature tolerance.
• Regulatory Compliance RoHS compliant to meet environmental and material requirements for commercial and industrial production.

Typical Applications

• Industrial Control Use the FPGA’s 48k logic elements and 500 I/Os for real-time control, I/O aggregation, and custom signal processing in automation systems.
• Communications & Data Interfaces Implement protocol bridging, parallel/serial interface logic, and data framing with abundant I/O and on-chip RAM for transient buffering.
• Embedded System Integration Integrate custom peripherals, glue logic, and moderate-size memory structures directly on-chip to reduce board-level BOM and simplify routing.

Unique Advantages

• High Logic Capacity: 48,000 logic elements enable complex logic implementations without immediate reliance on external programmable devices.
• Significant I/O Density: 500 I/O pins support multiple interfaces and high pin-count connectivity without large external multiplexing circuitry.
• On-chip Memory: Approximately 0.396 Mbits of embedded RAM reduces the need for small external memory components for buffering and temporary storage.
• Industrial Ready: Rated for −40 °C to 100 °C operation, making it suitable for industrial environments that demand extended temperature tolerance.
• Compact Surface-mount Package: 672‑BBGA (27×27 mm) provides a high-density package option for space-constrained board designs while maintaining manufacturability.

Why Choose LFE2-50E-5FN672I?

The LFE2-50E-5FN672I combines substantial programmable logic, on-chip memory, and a very high I/O count in a single industrial-grade, surface-mount package. Its defined core voltage range and wide operating temperature make it suitable for designers who need predictable electrical and thermal behavior in compact systems.

This device is well suited for engineering teams building industrial controllers, communication interfaces, and embedded platforms that benefit from integrated logic density, moderate embedded memory, and extensive I/O—helping reduce external components and simplify board-level design.

Request a quote or contact sales to discuss pricing, lead times, and availability for LFE2-50E-5FN672I.