LFE2-35SE-7FN672C

The LFE2-35SE-7FN672C is a field programmable gate array (FPGA) IC from Lattice Semiconductor built on the LatticeECP2 family architecture. It delivers high-density programmable logic, abundant I/O and on-chip memory for system integration tasks in commercial-grade designs.

With approximately 32,000 logic elements, about 0.34 Mbits of embedded RAM and up to 450 I/Os in a 672-ball BGA package, this device is aimed at applications that require dense logic, flexible I/O and integrated memory within a surface-mount, commercial-temperature FPGA solution.

Key Features

• Logic Capacity — Approximately 32,000 logic elements for implementing medium-to-high complexity designs.
• Memory — Total on-chip RAM of 339,968 bits (approximately 0.34 Mbits) to support embedded buffering, state storage, and small SRAM needs.
• DSP Resources — ECP2 family includes dedicated sysDSP blocks for efficient multiply-accumulate operations; refer to family data for block counts specific to the ECP2-35 device.
• I/O Density — Up to 450 I/O pins to support broad interfacing options and multi-channel connectivity.
• Package & Mounting — 672-ball fpBGA (27 × 27 mm) surface-mount package, supplier package listed as 672-FPBGA (27x27).
• Power — Core supply range from 1.14 V to 1.26 V to match system power domains.
• Operating Conditions — Commercial-grade device rated for 0 °C to 85 °C operation.
• Configuration & System Support — Built on the LatticeECP2 architecture which provides flexible device configuration, clocking resources and system-level features documented in the family datasheet.
• Compliance — RoHS-compliant device.

Typical Applications

• Communications Equipment — High I/O count and integrated memory make this device suitable for protocol bridging, interface aggregation and mid-range packet processing functions.
• Signal Processing — Dedicated DSP resources in the ECP2 family enable efficient implementation of multiply-accumulate intensive blocks for filtering and modulation tasks.
• Embedded System Integration — Dense logic plus on-chip RAM supports glue logic, control systems and custom peripheral integration within compact hardware platforms.
• Prototyping & Development — The 672-ball BGA package and rich I/O set are well suited for evaluating mid-density FPGA implementations before production deployment.

Unique Advantages

• High logic density: Approximately 32,000 logic elements allow integration of substantial functionality into a single device, reducing board-level component count.
• Generous I/O: Up to 450 I/Os facilitate multi-channel interfacing and flexible pin assignments for complex connectivity requirements.
• On-chip RAM: Nearly 0.34 Mbits of embedded memory supports local buffering and state retention without external SRAM.
• Compact BGA package: 672-ball fpBGA (27 × 27 mm) provides high pin count in a compact footprint for space-constrained designs.
• Commercial-grade thermal range: Rated for 0 °C to 85 °C operation, suitable for a wide range of consumer and commercial applications.
• RoHS compliant: Meets common lead-free manufacturing and environmental requirements.

Why Choose LFE2-35SE-7FN672C?

The LFE2-35SE-7FN672C balances substantial programmable logic capacity with high I/O density and integrated on-chip memory, making it a practical choice for commercial designs that require consolidated system logic, interface flexibility and local buffering. Its placement in the LatticeECP2 family brings access to family-level system features such as dedicated DSP resources and flexible clocking documented in the LatticeECP2 family datasheet.

This device is suited for developers and engineers targeting mid-range FPGA implementations where integration, predictable power rails (1.14–1.26 V core) and a compact 672-ball BGA footprint are priorities. Selecting this FPGA helps reduce external components while leveraging the Lattice ECP2 family architecture for scalable designs.

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