LFE2-35SE-6FN484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA

Quantity 549 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35SE-6FN484I – ECP2 Field Programmable Gate Array (FPGA) IC, 484-BBGA

The LFE2-35SE-6FN484I is a field programmable gate array (FPGA) device from Lattice Semiconductor’s ECP2 family. It provides a balance of logic capacity, embedded memory, and high I/O count in a compact 484-ball BGA package suitable for industrial-grade applications.

With 32,000 logic elements, approximately 0.34 Mbits of embedded RAM, and 331 general-purpose I/Os, this device targets designs that require moderate logic density, substantial on-chip memory, and extensive external interfacing while operating across an industrial temperature range.

Key Features

  • Core Logic  4,000 CLBs (configurable logic blocks) delivering 32,000 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 0.34 Mbits of on-chip RAM (339,968 bits) to support buffering, state storage, and local data processing.
  • I/O Capacity  331 user I/Os to simplify external device interfacing and system integration with sensors, peripherals, and communication lines.
  • Power  Single supply operating range from 1.14 V to 1.26 V to match system power-rail constraints and ensure predictable supply requirements.
  • Package & Mounting  484-ball BGA (484-FPBGA, 23×23) in a surface-mount package for compact board-level integration and reliable solder attachment.
  • Temperature & Grade  Industrial-grade device rated for operation from -40°C to 100°C for deployment in extended-temperature environments.
  • Environmental Compliance  RoHS compliant, supporting regulatory and environmental requirements for many electronic products.

Typical Applications

  • Industrial Control  Leverages industrial temperature range and robust logic density for control, sequencing, and real-time decision logic in factory and process automation systems.
  • Multi‑I/O Interface  High I/O count (331) supports bridging, protocol translation, and dense peripheral connectivity in embedded systems and communication equipment.
  • On‑chip Data Processing  Approximately 0.34 Mbits of embedded RAM combined with 32,000 logic elements enables local buffering and custom datapath implementations for mid‑range signal processing tasks.

Unique Advantages

  • Balanced Logic and Memory:  32,000 logic elements paired with ~0.34 Mbits of RAM provides a practical mix of resources for versatile mid-range FPGA designs.
  • Extensive I/O Availability:  331 general-purpose I/Os reduce the need for external multiplexers or I/O expanders, simplifying board-level design.
  • Industrial Temperature Rating:  Specified operation from -40°C to 100°C supports deployment in thermally demanding environments.
  • Compact BGA Footprint:  484-ball FPBGA (23×23) package allows high-pin-count connectivity in a relatively small PCB area for space-constrained applications.
  • Low-Voltage Operation:  Narrow supply range (1.14 V to 1.26 V) supports consistent power-system integration and predictable device behavior.
  • Regulatory Compliance:  RoHS compliance assists in meeting environmental requirements for commercial and industrial products.

Why Choose LFE2-35SE-6FN484I?

The LFE2-35SE-6FN484I combines a practical logic element count, substantial embedded memory, and an extensive I/O complement in an industrial-grade FPGA package. It is well suited for engineers seeking a mid-range programmable device that balances integration density, I/O connectivity, and thermal robustness.

Choose this device when your design requires a field-programmable solution with reliable industrial operation, compact BGA mounting, and a clear set of on-chip resources to implement control, interfacing, and local data processing functions.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the LFE2-35SE-6FN484I.

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