LFE2-35SE-6F672C

The LFE2-35SE-6F672C is an ECP2 family field programmable gate array (FPGA) from Lattice Semiconductor Corporation, supplied in a 672-ball BGA package. It provides a substantial logic fabric with 32,000 logic elements, approximately 0.34 Mbits of embedded memory, and a 450-pin I/O count for high-density interfacing.

Designed for commercial-grade applications, this surface-mount device operates from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C temperature range. The package is a 672-FPBGA (27×27) offering a compact, high-pin-count footprint while maintaining RoHS compliance.

Key Features

• Logic Capacity — 32,000 logic elements provide substantial programmable logic resources for mid-range FPGA designs.
• Embedded Memory — Approximately 0.34 Mbits of on-chip RAM suitable for buffering, small data structures, and state storage.
• I/O Density — 450 I/O pins enable extensive external interfacing and parallel connectivity in a single device.
• Package — 672-BBGA (supplier package: 672-FPBGA, 27×27) delivers a high-pin-count, compact footprint for surface-mount assembly.
• Power — Operates from a 1.14 V to 1.26 V core supply range, allowing designers to align power architecture to system requirements.
• Temperature and Grade — Commercial-grade device rated for operation from 0 °C to 85 °C.
• Compliance — RoHS compliant for regulatory and process compatibility.

Typical Applications

• High-density I/O conversion — 450 I/O pins support applications requiring many external interfaces or parallel connections.
• Mid-range logic integration — 32,000 logic elements make the device suitable for consolidating multiple logic functions into a single FPGA to reduce BOM and board complexity.
• On-chip buffering and control — Approximately 0.34 Mbits of embedded memory provide local storage for control logic, buffering, and small data structures.

Unique Advantages

• Balanced logic and memory: 32,000 logic elements combined with ~0.34 Mbits of RAM supports mixed control and data-path designs without external memory for small buffers.
• High I/O capacity: 450 I/O pins enable flexible system-level integration and support multiple parallel interfaces from one device.
• Compact, high-pin-count package: The 672-BBGA (672-FPBGA, 27×27) delivers dense connectivity in a space-efficient surface-mount form factor.
• Commercial temperature qualification: Rated 0 °C to 85 °C for use in commercial environments where that operating range is required.
• Low-voltage core: 1.14 V to 1.26 V supply compatibility aligns with contemporary low-voltage system power rails.
• RoHS compliant: Facilitates integration into compliant manufacturing and end-product supply chains.

Why Choose LFE2-35SE-6F672C?

This Lattice Semiconductor ECP2 FPGA balances substantial logic capacity, on-chip memory, and a high I/O count in a compact 672-ball BGA package, making it a practical choice for commercial embedded designs that require integrated logic and dense interfacing. Its voltage and temperature specifications fit modern low-voltage systems and standard commercial operating environments.

The device is well suited to designers seeking to consolidate discrete logic, small buffering, and multiple external interfaces into a single, RoHS-compliant FPGA to simplify board design and reduce component count.

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