LFE2-35SE-6F672I

The LFE2-35SE-6F672I is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a balance of programmable logic capacity and system I/O for embedded and industrial designs.

With 32,000 logic elements, approximately 0.34 Mbits of embedded memory and 450 I/O, this device targets applications that require high logic density, substantial on-chip memory and large I/O counts while operating in industrial temperature environments.

Key Features

• Core Logic  32,000 logic elements provide programmable logic capacity for glue logic, custom accelerators and control functions.
• Embedded Memory  Approximately 0.34 Mbits of on-chip RAM (339,968 bits) for buffering, lookup tables and small data structures.
• High I/O Count  450 available I/O pins to support wide parallel interfaces, multiple buses and dense signal routing.
• Power  Core supply range of 1.14 V to 1.26 V, enabling defined power planning for system integration.
• Package & Mounting  672-ball BGA in a 672-FPBGA (27×27) supplier package, designed for surface-mount PCB assembly and compact board layouts.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C and specified as Industrial grade for extended-environment use.
• RoHS Compliant  Meets RoHS requirements for environmental and material compliance.

Typical Applications

• Industrial Control  Suitable for programmable control and logic integration in industrial systems that require reliable operation across -40 °C to 100 °C.
• High-Density I/O Systems  Ideal for applications needing large numbers of parallel interfaces or multi-channel connectivity leveraging 450 I/O pins.
• Embedded Logic and Acceleration  Use the 32,000 logic elements and on-chip RAM for custom hardware acceleration, data path processing and glue logic in embedded platforms.

Unique Advantages

• Substantial Logic Capacity: 32,000 logic elements enable medium-to-high complexity designs without external programmable logic.
• Significant I/O Density: 450 I/O pins reduce the need for external multiplexers or expanders in connectivity-heavy designs.
• Embedded Memory On-Board: Approximately 0.34 Mbits of RAM supports buffering and state storage directly inside the FPGA fabric.
• Industrial-Grade Operation: Specified -40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact, High-Pin Package: The 672-BBGA (672-FPBGA, 27×27) package provides high pin count in a compact footprint for space-constrained boards.
• RoHS Compliance: Material compliance simplifies integration into products requiring environmental conformance.

Why Choose LFE2-35SE-6F672I?

The LFE2-35SE-6F672I positions itself as a robust mid-to-high density FPGA option with a blend of logic capacity, on-chip memory and a very large I/O count for complex embedded and industrial designs. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployments in demanding environments.

This device is appropriate for engineers seeking a scalable, high-I/O programmable logic solution that simplifies board-level integration and supports a broad range of industrial and embedded use cases while providing defined power and package characteristics for system planning.

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