LFE2-35SE-6F484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA |
|---|---|
| Quantity | 1,346 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-6F484I – Field Programmable Gate Array (FPGA)
The LFE2-35SE-6F484I is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial-grade embedded logic applications. It provides a mix of programmable logic, embedded memory, and a high I/O count suitable for complex control, signal processing, and interface tasks.
With 32,000 logic elements, approximately 0.34 Mbits of embedded memory, and up to 331 general-purpose I/O, this device targets designs that require medium-density programmable logic in a compact 484-ball BGA package. The device operates from a 1.14 V to 1.26 V core supply and is specified for operation from −40 °C to 100 °C.
Key Features
- Logic Capacity 32,000 logic elements provide flexible programmable logic resources for custom digital functions and moderate-complexity designs.
- Embedded Memory Approximately 0.34 Mbits (339,968 bits) of on-chip RAM for data buffering, FIFOs, and small lookup tables.
- I/O Density Up to 331 I/O pins to support multiple parallel interfaces, sensor connections, and peripheral control lines.
- Power Core supply voltage range of 1.14 V to 1.26 V to match modern low-voltage FPGA power domains.
- Package and Mounting 484-ball BBGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board layouts.
- Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
- RoHS Compliance RoHS-compliant construction for regulatory alignment in lead-free manufacturing environments.
Typical Applications
- Industrial Control Systems Implements motor control logic, real-time sequencing, and deterministic I/O aggregation in factory automation and machinery controls.
- Communications Equipment Handles protocol bridging, parallel interface adaptation, and custom packet handling where moderate logic density and many I/O are required.
- Signal Processing and Imaging Provides on-device buffering and custom datapath logic for preprocessing, filtering, and camera interfacing in machine vision and imaging modules.
- Embedded Prototyping and Custom Logic Acts as a development platform for custom IP blocks, interface conversion, and hardware acceleration in proof-of-concept and production designs.
Unique Advantages
- Balanced Logic and Memory: 32,000 logic elements paired with approximately 0.34 Mbits of embedded RAM supports both control-oriented and data-path functions without external RAM for many designs.
- High I/O Count: 331 I/O pins enable direct connection to multiple peripherals, sensors, or buses, reducing the need for external multiplexing.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-variable or harsh industrial environments.
- Compact BGA Package: 484-ball BBGA (23×23) offers a small board footprint while maintaining high pin density for complex interconnects.
- Low-Voltage Core: 1.14 V to 1.26 V supply aligns with modern FPGA power architectures for efficient power budgeting.
- RoHS-Compliant: Supports lead-free manufacturing and compliance requirements.
Why Choose LFE2-35SE-6F484I?
The LFE2-35SE-6F484I positions itself as an industrial-grade, medium-density FPGA option offering a practical balance of logic resources, on-chip memory, and extensive I/O in a compact BGA package. It is well-suited for engineers designing industrial controls, communications interfaces, or embedded signal-processing subsystems that require reliable operation across a broad temperature range.
Choosing this device provides designers a single-chip solution to consolidate multiple interface and control functions, simplify board-level routing with high I/O count, and meet industrial environmental requirements while maintaining a compact surface-mount footprint.
Request a quote or submit a purchase inquiry to check availability and pricing for the LFE2-35SE-6F484I. Our team can provide lead-time information and support to help integrate this FPGA into your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016