LFE2-35SE-5FN484I

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA

Quantity 1,087 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35SE-5FN484I – ECP2 Field Programmable Gate Array (484-BBGA)

The LFE2-35SE-5FN484I is an industrial-grade Lattice ECP2-series FPGA in a 484-ball BBGA package. It delivers a mid-range logic capacity and on-chip memory footprint suited for system integration tasks where a balance of logic resources, I/O count and compact packaging are required.

Designed for embedded and industrial applications, this device combines approximately 32,000 logic elements, significant embedded RAM and a large I/O complement to support control, interface bridging and mid-density signal processing tasks while operating across a wide commercial-to-industrial temperature range.

Key Features

  • Logic Capacity  Approximately 32,000 logic elements providing the fabric for glue logic, protocol handling and mid-density FPGA implementations.
  • Embedded Memory  Approximately 0.34 Mbits of on-chip RAM (339,968 bits) for frame buffers, FIFOs and small embedded data stores.
  • I/O and Package  331 user I/O pins in a 484-BBGA (484-FPBGA, 23 × 23 mm) package, enabling dense connectivity for multi‑interface designs.
  • Power  Core voltage supply specified from 1.14 V to 1.26 V to match target system power rails.
  • Temperature and Grade  Industrial-grade device rated for operation from –40 °C to 100 °C for demanding environmental conditions.
  • Clocking and DSP (Family Capabilities)  Lattice ECP2 family features include integrated PLL/DLL clock resources and enhanced sysDSP blocks for multiply/accumulate operations (family-level capabilities described in the datasheet).
  • Configuration and Compatibility  Part of the Lattice ECP2 family with flexible device configuration options and system-level features documented in the family datasheet.
  • RoHS Compliance  RoHS-compliant construction for global manufacturing requirements.

Typical Applications

  • Industrial Control  Use as a mid-density logic and interface hub for motor control, PLC extensions or machine I/O aggregation benefiting from industrial temperature operation.
  • Communications Interfaces  Protocol bridging, I/O serialization and interface adaptation where a large number of user I/Os and embedded memory buffers are required.
  • Embedded Processing  Offload or accelerate embedded signal processing tasks using the ECP2 family’s DSP resources and on-chip RAM for buffering.
  • Test & Measurement  Custom data acquisition front-ends and pre-processing logic that require deterministic operation across commercial and industrial environments.

Unique Advantages

  • Balanced Resource Set:  Combines ~32,000 logic elements with ~0.34 Mbits of embedded RAM for mid-range FPGA designs without excessive overhead.
  • High Pin Count in a Compact Footprint:  331 I/Os in a 23 × 23 mm 484‑ball FPBGA enables dense external connectivity while minimizing board area.
  • Industrial Temperature Range:  Rated from –40 °C to 100 °C for reliable operation in harsh environments and extended-temperature applications.
  • Low-Voltage Core:  1.14–1.26 V core supply range aligns with modern low-voltage system architectures.
  • RoHS-Compliant Construction:  Meets material requirements for modern manufacturing and global distribution.

Why Choose LFE2-35SE-5FN484I?

The LFE2-35SE-5FN484I offers a practical mix of logic, memory and I/O density for engineers building mid-range FPGA systems that must operate in industrial environments. Its combination of approximately 32,000 logic elements, roughly 0.34 Mbits of embedded RAM and 331 I/Os in a 484‑ball BBGA package makes it well suited for interface-heavy designs, embedded processing tasks and control systems where board space and environmental robustness matter.

As a member of the Lattice ECP2 family, this device inherits family-level features such as advanced clocking resources and DSP capabilities documented in the family datasheet, providing design scalability and a familiar development ecosystem for teams targeting similar performance points.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for the LFE2-35SE-5FN484I. Our team can help evaluate the device for your design needs and provide lead-time details.

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