LFE2-35SE-5FN484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA |
|---|---|
| Quantity | 1,087 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-5FN484I – ECP2 Field Programmable Gate Array (484-BBGA)
The LFE2-35SE-5FN484I is an industrial-grade Lattice ECP2-series FPGA in a 484-ball BBGA package. It delivers a mid-range logic capacity and on-chip memory footprint suited for system integration tasks where a balance of logic resources, I/O count and compact packaging are required.
Designed for embedded and industrial applications, this device combines approximately 32,000 logic elements, significant embedded RAM and a large I/O complement to support control, interface bridging and mid-density signal processing tasks while operating across a wide commercial-to-industrial temperature range.
Key Features
- Logic Capacity Approximately 32,000 logic elements providing the fabric for glue logic, protocol handling and mid-density FPGA implementations.
- Embedded Memory Approximately 0.34 Mbits of on-chip RAM (339,968 bits) for frame buffers, FIFOs and small embedded data stores.
- I/O and Package 331 user I/O pins in a 484-BBGA (484-FPBGA, 23 × 23 mm) package, enabling dense connectivity for multi‑interface designs.
- Power Core voltage supply specified from 1.14 V to 1.26 V to match target system power rails.
- Temperature and Grade Industrial-grade device rated for operation from –40 °C to 100 °C for demanding environmental conditions.
- Clocking and DSP (Family Capabilities) Lattice ECP2 family features include integrated PLL/DLL clock resources and enhanced sysDSP blocks for multiply/accumulate operations (family-level capabilities described in the datasheet).
- Configuration and Compatibility Part of the Lattice ECP2 family with flexible device configuration options and system-level features documented in the family datasheet.
- RoHS Compliance RoHS-compliant construction for global manufacturing requirements.
Typical Applications
- Industrial Control Use as a mid-density logic and interface hub for motor control, PLC extensions or machine I/O aggregation benefiting from industrial temperature operation.
- Communications Interfaces Protocol bridging, I/O serialization and interface adaptation where a large number of user I/Os and embedded memory buffers are required.
- Embedded Processing Offload or accelerate embedded signal processing tasks using the ECP2 family’s DSP resources and on-chip RAM for buffering.
- Test & Measurement Custom data acquisition front-ends and pre-processing logic that require deterministic operation across commercial and industrial environments.
Unique Advantages
- Balanced Resource Set: Combines ~32,000 logic elements with ~0.34 Mbits of embedded RAM for mid-range FPGA designs without excessive overhead.
- High Pin Count in a Compact Footprint: 331 I/Os in a 23 × 23 mm 484‑ball FPBGA enables dense external connectivity while minimizing board area.
- Industrial Temperature Range: Rated from –40 °C to 100 °C for reliable operation in harsh environments and extended-temperature applications.
- Low-Voltage Core: 1.14–1.26 V core supply range aligns with modern low-voltage system architectures.
- RoHS-Compliant Construction: Meets material requirements for modern manufacturing and global distribution.
Why Choose LFE2-35SE-5FN484I?
The LFE2-35SE-5FN484I offers a practical mix of logic, memory and I/O density for engineers building mid-range FPGA systems that must operate in industrial environments. Its combination of approximately 32,000 logic elements, roughly 0.34 Mbits of embedded RAM and 331 I/Os in a 484‑ball BBGA package makes it well suited for interface-heavy designs, embedded processing tasks and control systems where board space and environmental robustness matter.
As a member of the Lattice ECP2 family, this device inherits family-level features such as advanced clocking resources and DSP capabilities documented in the family datasheet, providing design scalability and a familiar development ecosystem for teams targeting similar performance points.
Request a quote or submit an inquiry to receive pricing, availability and technical support information for the LFE2-35SE-5FN484I. Our team can help evaluate the device for your design needs and provide lead-time details.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016