LFE2-35SE-5FN672I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA |
|---|---|
| Quantity | 600 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 450 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-5FN672I – ECP2 FPGA, 32,000 Logic Elements, 450 I/O, 672-BBGA
The LFE2-35SE-5FN672I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a mid-density programmable logic solution with 32,000 logic elements, substantial on-chip memory and a high I/O count for designs requiring significant connectivity and integration.
Designed for industrial applications, the device supports surface-mount board integration in a 672-BBGA package and operates across a wide supply range and industrial temperature window, making it suitable for systems that demand robust electrical and thermal performance.
Key Features
- Core Architecture
ECP2 Field Programmable Gate Array IC offering 32,000 logic elements for mid-density programmable logic implementations. - Logic Array Blocks
4,000 LABs to structure and organize programmable logic resources. - Embedded Memory
Approximately 0.34 Mbits of embedded memory (339,968 total RAM bits) for on-chip data buffering and small storage functions. - High I/O Count
450 I/O pins to support designs with extensive external interfacing requirements. - Power
Wide core supply range from 1.14 V to 1.26 V to match system power domains. - Package & Mounting
672-BBGA package (supplier: 672-FPBGA, 27×27) for compact, surface-mount PCB implementations. - Industrial Temperature Range
Rated for operation from −40 °C to 100 °C for use in industrial environments. - Compliance
RoHS compliant.
Typical Applications
- High-density I/O systems
Leverage 450 I/O pins for designs requiring extensive peripheral and signal routing. - On-chip buffering and control
Use approximately 0.34 Mbits of embedded RAM for local data buffering, state storage, and small memory functions. - Industrial embedded systems
Industrial-grade rating and −40 °C to 100 °C operation support deployment in temperature-challenging environments. - Compact, surface-mount designs
672-BBGA package enables high-density board layouts with surface-mount assembly processes.
Unique Advantages
- High logic density: 32,000 logic elements provide substantial programmable resources for mid-complexity logic implementations.
- Extensive external connectivity: 450 I/O pins reduce the need for external multiplexing or I/O expanders when interfacing multiple peripherals.
- Embedded memory on-chip: Approximately 0.34 Mbits of RAM supports local buffering and reduces dependency on external memory for small data sets.
- Industrial-grade reliability: Rated operation from −40 °C to 100 °C matches industrial system requirements for temperature resilience.
- Compact package integration: 672-BBGA (27×27) surface-mount package simplifies PCB area planning while supporting high pin counts.
- RoHS compliant: Meets environmental compliance requirements for many supply chains and manufacturing processes.
Why Choose LFE2-35SE-5FN672I?
The LFE2-35SE-5FN672I positions itself as a robust mid-density FPGA choice for engineers needing a balance of logic capacity, significant I/O, and on-chip memory in an industrial-grade component. Its combination of 32,000 logic elements, 450 I/O, and a compact 672-BBGA surface-mount package makes it well suited for embedded designs that demand integration and thermal robustness.
Manufactured by Lattice Semiconductor Corporation and RoHS compliant, this device is appropriate for teams targeting reliable, scalable FPGA-based implementations where board space, I/O count and industrial operation are primary considerations.
Request a quote or submit a purchasing inquiry to evaluate the LFE2-35SE-5FN672I for your next design.