LFE2-35SE-5FN672I

IC FPGA 450 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA

Quantity 600 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O450Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35SE-5FN672I – ECP2 FPGA, 32,000 Logic Elements, 450 I/O, 672-BBGA

The LFE2-35SE-5FN672I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a mid-density programmable logic solution with 32,000 logic elements, substantial on-chip memory and a high I/O count for designs requiring significant connectivity and integration.

Designed for industrial applications, the device supports surface-mount board integration in a 672-BBGA package and operates across a wide supply range and industrial temperature window, making it suitable for systems that demand robust electrical and thermal performance.

Key Features

  • Core Architecture 
    ECP2 Field Programmable Gate Array IC offering 32,000 logic elements for mid-density programmable logic implementations.
  • Logic Array Blocks 
    4,000 LABs to structure and organize programmable logic resources.
  • Embedded Memory 
    Approximately 0.34 Mbits of embedded memory (339,968 total RAM bits) for on-chip data buffering and small storage functions.
  • High I/O Count 
    450 I/O pins to support designs with extensive external interfacing requirements.
  • Power 
    Wide core supply range from 1.14 V to 1.26 V to match system power domains.
  • Package & Mounting 
    672-BBGA package (supplier: 672-FPBGA, 27×27) for compact, surface-mount PCB implementations.
  • Industrial Temperature Range 
    Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • Compliance 
    RoHS compliant.

Typical Applications

  • High-density I/O systems 
    Leverage 450 I/O pins for designs requiring extensive peripheral and signal routing.
  • On-chip buffering and control 
    Use approximately 0.34 Mbits of embedded RAM for local data buffering, state storage, and small memory functions.
  • Industrial embedded systems 
    Industrial-grade rating and −40 °C to 100 °C operation support deployment in temperature-challenging environments.
  • Compact, surface-mount designs 
    672-BBGA package enables high-density board layouts with surface-mount assembly processes.

Unique Advantages

  • High logic density: 32,000 logic elements provide substantial programmable resources for mid-complexity logic implementations.
  • Extensive external connectivity: 450 I/O pins reduce the need for external multiplexing or I/O expanders when interfacing multiple peripherals.
  • Embedded memory on-chip: Approximately 0.34 Mbits of RAM supports local buffering and reduces dependency on external memory for small data sets.
  • Industrial-grade reliability: Rated operation from −40 °C to 100 °C matches industrial system requirements for temperature resilience.
  • Compact package integration: 672-BBGA (27×27) surface-mount package simplifies PCB area planning while supporting high pin counts.
  • RoHS compliant: Meets environmental compliance requirements for many supply chains and manufacturing processes.

Why Choose LFE2-35SE-5FN672I?

The LFE2-35SE-5FN672I positions itself as a robust mid-density FPGA choice for engineers needing a balance of logic capacity, significant I/O, and on-chip memory in an industrial-grade component. Its combination of 32,000 logic elements, 450 I/O, and a compact 672-BBGA surface-mount package makes it well suited for embedded designs that demand integration and thermal robustness.

Manufactured by Lattice Semiconductor Corporation and RoHS compliant, this device is appropriate for teams targeting reliable, scalable FPGA-based implementations where board space, I/O count and industrial operation are primary considerations.

Request a quote or submit a purchasing inquiry to evaluate the LFE2-35SE-5FN672I for your next design.

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