LFE2-20SE-6Q208C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP |
|---|---|
| Quantity | 774 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-6Q208C – ECP2 FPGA, 208‑BFQFP
The LFE2-20SE-6Q208C is an ECP2 field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial embedded logic applications. It delivers a mid-range combination of programmable logic, embedded RAM, and I/O resources in a compact 208‑lead BFQFP package.
With 2,625 CLBs providing approximately 21,000 logic elements and roughly 0.283 Mbits of on-chip RAM, this device targets designs that require moderate logic density, substantial I/O, and low-voltage operation within a commercial temperature range.
Key Features
- Logic Capacity — 2,625 CLBs providing approximately 21,000 logic elements to implement combinational and sequential logic functions.
- Embedded Memory — Approximately 0.283 Mbits of on-chip RAM (282,624 bits) for data buffering, small FIFOs, and state storage.
- I/O Resources — 131 general-purpose I/O pins to support multiple interfaces and peripheral connections.
- Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
- Package and Mounting — 208‑BFQFP package (supplier package: 208‑PQFP, 28×28) in a surface-mount form factor for PCB integration.
- Temperature Grade — Commercial operating temperature range from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- Balanced logic and memory: Combines 2,625 CLBs with approximately 0.283 Mbits of embedded RAM to support mixed logic and buffering needs without external memory for many functions.
- High I/O density: 131 I/O pins enable flexible connectivity options for multiple peripherals and interfaces within a single device.
- Compact, surface-mount package: The 208‑lead BFQFP (208‑PQFP supplier package) delivers a space-efficient footprint for board-level integration.
- Low-voltage operation: Core supply range of 1.14 V to 1.26 V supports designs optimized for lower power consumption at the device core.
- Commercial grade and compliant: Rated for 0 °C to 85 °C and RoHS compliant to meet standard commercial product requirements and regulatory needs.
Why Choose LFE2-20SE-6Q208C?
The LFE2-20SE-6Q208C positions itself as a practical, mid-density FPGA option that combines a substantial logic fabric with embedded memory and a broad I/O complement, all in a compact 208‑lead package. Its low-voltage core and commercial temperature rating make it suitable for a wide range of commercial embedded designs requiring programmable logic, deterministic I/O count, and on-chip storage.
Choose this device when you need a single-component programmable solution that balances logic capacity, memory, and I/O in a RoHS-compliant package backed by Lattice Semiconductor Corporation’s product family support.
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