LFE2-20SE-6FN672C

The LFE2-20SE-6FN672C is an ECP2 family FPGA IC from Lattice Semiconductor, delivered in a compact 672-BBGA package. It provides a mid-density, commercially graded programmable logic option with a balance of logic resources, on-chip memory and I/O capacity suitable for a wide range of general-purpose embedded designs.

With 21,000 logic elements, 2,625 CLBs and approximately 0.28 Mbits of embedded memory, this device targets applications that require programmable logic integration, flexible I/O and low-voltage operation in a surface-mount, RoHS-compliant package.

Key Features

• Core Logic 21,000 logic elements and 2,625 CLBs provide mid-density programmable logic for custom glue logic, protocol bridging and control functions.
• Embedded Memory Approximately 0.28 Mbits (282,624 bits) of on-chip RAM for buffering, small data tables and state storage.
• I/O Capacity 402 I/O pins to support multiple interfaces, peripheral connections and board-level integration without external I/O expanders.
• Power Operates from a core voltage supply range of 1.14 V to 1.26 V to match low-voltage system rails.
• Package & Mounting 672-BBGA package (supplier package: 672-FPBGA, 27×27 mm) in a surface-mount form factor for compact, high-density PCB designs.
• Temperature & Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction for regulatory and manufacturing alignment.

Typical Applications

• Moderate-density embedded logic — Ideal for designs that require customizable logic functions and local control without high-density FPGA resources.
• I/O aggregation and protocol bridging — Suitable where up to 402 I/O are needed to interface multiple peripherals, buses or legacy interfaces.
• On-board buffering and small-data processing — Built-in on-chip RAM supports small buffers, FIFOs and lookup tables for control and data-handling tasks.

Unique Advantages

• Balanced resource set: Combines 21,000 logic elements with 2,625 CLBs to meet mid-range programmable logic requirements without overprovisioning.
• Generous I/O count: 402 I/O pins reduce the need for external multiplexing or expanders, simplifying board-level design.
• Compact package: 672-BBGA (27×27 mm supplier package) delivers high pin density in a surface-mount footprint for space-constrained PCBs.
• Low-voltage core: 1.14 V to 1.26 V supply compatibility for integration into modern low-voltage systems.
• Commercial-grade suitability: Specified 0 °C to 85 °C operation for mainstream electronics and consumer-oriented applications.
• RoHS compliant: Environmentally compliant manufacturing support for regulated production environments.

Why Choose LFE2-20SE-6FN672C?

The LFE2-20SE-6FN672C positions itself as a pragmatic, mid-density FPGA choice for engineers needing a balance of logic, memory and I/O in a compact BGA package. Its combination of 21,000 logic elements, substantial I/O and on-chip RAM makes it well suited to embedded control, interface consolidation and moderate-complexity custom logic implementations.

This device is appropriate for designers and teams who require a commercially graded, surface-mount FPGA solution with low-voltage operation and RoHS compliance, offering scalability and integration to streamline bill-of-materials and board-level design decisions.

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