LFE2-20SE-6FN256I

The LFE2-20SE-6FN256I is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation within the ECP2 family. It provides reprogrammable logic capacity, embedded RAM and a large complement of I/O in a 256-ball BGA package, targeted for industrial applications.

This device is designed for systems that require configurable logic resources and I/O density while operating across an industrial temperature range and low-voltage core supply.

Key Features

• Core Logic  Approximately 21,000 logic elements suitable for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.28 Mbits (282,624 bits) of on-chip RAM for buffering, state storage and temporary data.
• I/O  193 user I/O pins to support multiple interfaces and peripheral connections.
• Power  Core voltage supply range from 1.14 V to 1.26 V, enabling operation within a defined low-voltage domain.
• Package and Mounting  256-ball BGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
• Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial control systems  Use the device’s 21,000 logic elements and 193 I/Os for configurable control, I/O aggregation and custom sequencing in industrial equipment.
• Data interface bridging  Leverage the available on-chip RAM and high I/O count to implement protocol adaptation and buffering between subsystems.
• Embedded processing support  Implement custom datapaths and peripheral glue logic where compact packaging and industrial temperature operation are required.

Unique Advantages

• Ample configurable logic: Approximately 21,000 logic elements allow implementation of medium-complexity digital functions without external ASICs.
• On-chip memory for buffering: About 0.28 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• High I/O density: 193 I/Os provide flexibility for interfacing multiple peripherals and buses directly to the FPGA.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in environments with extended thermal requirements.
• Compact BGA package: 256-ball FPBGA (17×17) supports dense PCB layouts while maintaining surface-mount assembly compatibility.
• RoHS compliant: Conforms to RoHS requirements for regulated material restrictions.

Why Choose LFE2-20SE-6FN256I?

The LFE2-20SE-6FN256I offers a balanced combination of logic capacity, embedded RAM and a high I/O count in a compact 256-BGA package, making it suitable for industrial designs that require reprogrammable logic and reliable operation across a wide temperature range. Its low-voltage core and RoHS compliance align with modern system power and environmental considerations.

This device is appropriate for engineers and procurement teams seeking a mid-range FPGA solution from Lattice Semiconductor for applications that need configurable logic, substantial I/O, and embedded memory in an industrial-grade package.

If you would like pricing, availability or a formal quote for the LFE2-20SE-6FN256I, please submit a quote request or contact our sales channel for more information.