LFE2-20SE-6F672I

The LFE2-20SE-6F672I is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation offered in a 672-ball BGA package. It provides a balance of logic density, on-chip memory, and I/O capacity tailored for industrial-grade embedded designs.

With 21,000 logic elements, approximately 0.283 Mbits of embedded RAM and 402 user I/O pins, this device is suited to applications that require moderate logic integration, substantial I/O connectivity and operation across an industrial temperature range.

Key Features

• Core Logic — 21,000 logic elements for implementing custom digital functions and moderate-complexity designs.
• On-Chip Memory — Approximately 0.283 Mbits of embedded RAM (282,624 bits) for buffering, packet handling or small data structures.
• I/O Density — 402 user I/O pins to support broad interfacing with peripherals, sensors and high-pin-count connectors.
• Power — Core supply range of 1.14 V to 1.26 V to match system power rails and designers’ supply constraints.
• Package & Mounting — 672-ball BGA (supplier package: 672-FPBGA, 27×27 mm) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, appropriate for industrial environments.
• Regulatory Compliance — RoHS compliant for use in assemblies that require lead-free materials.

Typical Applications

• Industrial Control — Implement control logic, motor drives interface and sensor aggregation using the device’s industrial temperature rating and broad I/O.
• Communications and Networking — Use the available logic elements and on-chip RAM for protocol bridging, packet buffering or custom interface logic.
• Instrumentation and Test — Leverage high I/O count and configurable logic to implement data acquisition front-ends and real-time processing functions.

Unique Advantages

• High logic integration: 21,000 logic elements enable consolidated implementation of multiple functions on a single device, reducing BOM complexity.
• Substantial I/O capacity: 402 I/O pins provide flexibility for dense peripheral connectivity and multi-channel interfaces.
• Compact BGA package: 672-ball FPBGA (27×27 mm) supports space-constrained board designs while maintaining high pin count.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in industrial and harsh-environment applications.
• Embedded memory on-chip: Approximately 0.283 Mbits of RAM available for buffering and local data storage without external memory.
• RoHS compliant: Meets lead-free assembly requirements for modern production environments.

Why Choose LFE2-20SE-6F672I?

The LFE2-20SE-6F672I positions itself as a versatile industrial-grade FPGA option that combines moderate logic capacity, significant I/O density and on-chip memory in a compact BGA package. Its supply voltage range and industrial temperature rating align with demanding embedded designs that require reliable operation across a wide thermal range.

This device is well suited for design teams seeking to consolidate discrete logic and interface functions into a single programmable device while maintaining flexibility for future updates. The combination of logic elements, RAM and I/O makes it appropriate for industrial control, communications interface and instrumentation applications where RoHS compliance and surface-mount packaging are required.

Request a quote or submit an inquiry to obtain pricing and availability information for the LFE2-20SE-6F672I and begin evaluating it for your next design.