LFE2-20SE-6FN484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA |
|---|---|
| Quantity | 209 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-6FN484I – ECP2 Field Programmable Gate Array (FPGA)
The LFE2-20SE-6FN484I is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It delivers a mid-range integration point with 21,000 logic elements, dedicated on-chip RAM, and a high I/O count to address logic‑dense, I/O‑heavy designs.
Designed for industrial environments, this surface‑mount FPGA provides a narrow core voltage range and an extended operating temperature range to support robust embedded applications that require predictable electrical and thermal characteristics.
Key Features
- Core Logic 21,000 logic elements for implementing mid-density digital logic and custom hardware acceleration.
- On‑chip Memory Approximately 0.28 Mbits of embedded memory (282,624 total RAM bits) to support buffers, FIFOs and small data storage on-chip.
- I/O Capacity 331 user I/Os for connectivity to peripherals, sensors, and external interfaces.
- Power Core voltage supply range of 1.14 V to 1.26 V for stable power requirements and predictable core operation.
- Package & Mounting 484-ball BGA package (listed as 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C to suit temperature‑challenging environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Automation Use as programmable logic for control and I/O aggregation where industrial temperature range and high I/O counts are required.
- Communications Equipment Implement protocol glue logic, bus interfacing, and custom packet handling using the device’s logic density and on‑chip memory.
- Embedded Systems & Prototyping Deploy as a reprogrammable platform for validating digital designs that need significant logic resources and many I/O connections.
Unique Advantages
- High logic density: 21,000 logic elements enable substantial on-chip logic integration without external CPLDs or discrete glue logic.
- Compact BGA footprint: 484‑ball BBGA package (484‑FPBGA, 23×23) supports high I/O counts in a space‑efficient, surface‑mount form factor.
- Substantial embedded memory: Approximately 0.28 Mbits of on‑chip RAM reduces dependence on external memory for small buffers and FIFOs.
- Robust operating range: Industrial grade rating and −40 °C to 100 °C operation support deployments in temperature‑demanding environments.
- Predictable core power: Narrow voltage supply window (1.14 V–1.26 V) simplifies power sequencing and core supply design.
- Regulatory compliance: RoHS compliance supports environmentally driven procurement requirements.
Why Choose LFE2-20SE-6FN484I?
The LFE2-20SE-6FN484I positions itself as a practical choice for engineers needing a mid-density FPGA with ample I/O, on‑chip memory, and industrial temperature capability. Its 21,000 logic elements and 331 I/Os make it suitable for designs that require significant programmable logic and connectivity while maintaining a compact BGA package footprint.
With a well-defined core voltage range and RoHS compliance, this FPGA is appropriate for customers developing embedded and industrial systems that prioritize predictable electrical behavior and environmental compliance.
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