LFECP10E-3F484C

IC FPGA 288 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 288 282624 10200 484-BBGA

Quantity 1,086 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O288Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFECP10E-3F484C – ECP FPGA, 10,200 Logic Elements, 484-BBGA

The LFECP10E-3F484C is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 484-BBGA (484-FPBGA, 23×23) surface-mount package. It provides a mid-range logic resource set with 10,200 logic elements, substantial I/O capacity, and on-chip RAM to support configurable digital designs.

With a supply voltage range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that require flexible programmable logic, sizable I/O, and embedded memory in a compact package.

Key Features

  • Logic Density  Approximately 10,200 logic elements for implementing custom digital functions and state machines.
  • Embedded Memory  Approximately 0.283 Mbits of on-chip RAM (282,624 total RAM bits) to support data buffering, FIFOs, and small memory structures.
  • High I/O Count  288 user I/O pins to accommodate parallel interfaces, multiple peripherals, and cross-domain signal routing.
  • Low-Voltage Core  Core supply range of 1.14 V to 1.26 V for low-voltage system integration and compatibility with modern power rails.
  • Package & Mounting  484-BBGA (supplier device package 484-FPBGA, 23×23) in a surface-mount form factor for dense board integration.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial and consumer applications.
  • RoHS Compliant  Conforms to RoHS requirements for restriction of hazardous substances.

Typical Applications

  • Embedded Systems  Use the device’s ~10,200 logic elements and on-chip RAM to implement custom control logic, data aggregation, and pre-processing tasks in embedded designs.
  • High-Density I/O Interfaces  The 288 I/O pins enable bridging, protocol conversion, and multi-peripheral interfacing where many signals must be routed and managed.
  • Prototyping & Development  The programmable logic resource and compact 484-BBGA package make the device suitable for functional prototypes and lab validation of digital designs.

Unique Advantages

  • Balanced Logic and Memory: The combination of ~10,200 logic elements and ~0.283 Mbits of RAM supports a wide range of mid‑complexity functions without external memory for many tasks.
  • Extensive I/O Capacity: 288 I/O pins provide flexibility for complex interfacing needs and parallel signal handling on a single device.
  • Compact BGA Packaging: The 484-FPBGA (23×23) package enables high-density PCB layouts while keeping the solution surface-mount friendly.
  • Low-Voltage Operation: A narrow core supply range (1.14 V–1.26 V) facilitates integration with low-voltage power architectures.
  • RoHS Compliance: Environmentally compliant construction supports regulatory requirements for many markets.
  • Manufacturer Backing: Produced by Lattice Semiconductor Corporation, the device is part of an established FPGA product offering.

Why Choose LFECP10E-3F484C?

The LFECP10E-3F484C positions itself as a mid-range, commercially graded FPGA offering a practical balance of logic capacity, embedded RAM, and high I/O count in a compact 484-BBGA package. It is suited for designers and procurement teams seeking a programmable solution for embedded systems, interface consolidation, and prototype development that operates at low core voltage and within standard commercial temperature ranges.

Choosing this device provides a single-chip option for consolidating discrete logic, supporting significant I/O, and implementing on-chip memory structures, all from a reputable FPGA manufacturer.

Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering information for the LFECP10E-3F484C.

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