LFECP10E-3F484C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 288 282624 10200 484-BBGA |
|---|---|
| Quantity | 1,086 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 288 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFECP10E-3F484C – ECP FPGA, 10,200 Logic Elements, 484-BBGA
The LFECP10E-3F484C is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 484-BBGA (484-FPBGA, 23×23) surface-mount package. It provides a mid-range logic resource set with 10,200 logic elements, substantial I/O capacity, and on-chip RAM to support configurable digital designs.
With a supply voltage range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that require flexible programmable logic, sizable I/O, and embedded memory in a compact package.
Key Features
- Logic Density Approximately 10,200 logic elements for implementing custom digital functions and state machines.
- Embedded Memory Approximately 0.283 Mbits of on-chip RAM (282,624 total RAM bits) to support data buffering, FIFOs, and small memory structures.
- High I/O Count 288 user I/O pins to accommodate parallel interfaces, multiple peripherals, and cross-domain signal routing.
- Low-Voltage Core Core supply range of 1.14 V to 1.26 V for low-voltage system integration and compatibility with modern power rails.
- Package & Mounting 484-BBGA (supplier device package 484-FPBGA, 23×23) in a surface-mount form factor for dense board integration.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for standard commercial and consumer applications.
- RoHS Compliant Conforms to RoHS requirements for restriction of hazardous substances.
Typical Applications
- Embedded Systems Use the device’s ~10,200 logic elements and on-chip RAM to implement custom control logic, data aggregation, and pre-processing tasks in embedded designs.
- High-Density I/O Interfaces The 288 I/O pins enable bridging, protocol conversion, and multi-peripheral interfacing where many signals must be routed and managed.
- Prototyping & Development The programmable logic resource and compact 484-BBGA package make the device suitable for functional prototypes and lab validation of digital designs.
Unique Advantages
- Balanced Logic and Memory: The combination of ~10,200 logic elements and ~0.283 Mbits of RAM supports a wide range of mid‑complexity functions without external memory for many tasks.
- Extensive I/O Capacity: 288 I/O pins provide flexibility for complex interfacing needs and parallel signal handling on a single device.
- Compact BGA Packaging: The 484-FPBGA (23×23) package enables high-density PCB layouts while keeping the solution surface-mount friendly.
- Low-Voltage Operation: A narrow core supply range (1.14 V–1.26 V) facilitates integration with low-voltage power architectures.
- RoHS Compliance: Environmentally compliant construction supports regulatory requirements for many markets.
- Manufacturer Backing: Produced by Lattice Semiconductor Corporation, the device is part of an established FPGA product offering.
Why Choose LFECP10E-3F484C?
The LFECP10E-3F484C positions itself as a mid-range, commercially graded FPGA offering a practical balance of logic capacity, embedded RAM, and high I/O count in a compact 484-BBGA package. It is suited for designers and procurement teams seeking a programmable solution for embedded systems, interface consolidation, and prototype development that operates at low core voltage and within standard commercial temperature ranges.
Choosing this device provides a single-chip option for consolidating discrete logic, supporting significant I/O, and implementing on-chip memory structures, all from a reputable FPGA manufacturer.
Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering information for the LFECP10E-3F484C.

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