LFECP10E-3FN256I

The LFECP10E-3FN256I is an ECP family Field Programmable Gate Array (FPGA) optimized for mainstream, cost-sensitive designs that require DSP capability, flexible I/O and embedded memory. Built on the LatticeECP architecture, this device delivers 10,200 logic elements, extensive I/O and on-chip RAM to support a wide range of embedded and system-level applications.

This industrial-grade, surface-mount 256-ball fpBGA (17×17 mm) device supports core voltages from 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, making it suitable for robust, temperature-demanding deployments.

Key Features

• Logic Capacity  10,200 logic elements (approximately 10.2K LUT4s) to implement medium-complexity digital logic and control functions.
• On-chip Memory  Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) for distributed and embedded memory requirements.
• I/O Density  195 I/Os available in the 256-ball fpBGA package to interface with multiple peripherals and subsystems.
• Package & Mounting  256-FPBGA (17×17 mm) package, surface mount, compact footprint for space-constrained board designs.
• Industrial Temperature Grade  Specified operating range from −40 °C to 100 °C to meet industrial environment requirements.
• Low-Voltage Core  Core supply range 1.14 V to 1.26 V consistent with low-power, modern FPGA cores.
• Family Features (LatticeECP)  LatticeECP family capabilities include sysDSP blocks for high-performance multiply‑accumulate functions, flexible sysI/O buffer support for a wide set of I/O standards, dedicated DDR memory interface support and up to four analog PLLs for clock management.
• Standards & Compliance  RoHS compliant.

Typical Applications

• Cost-sensitive mainstream FPGA designs  Deploy the device where a balance of logic capacity, I/O and embedded memory is needed to control system functions while managing BOM cost.
• DSP-accelerated embedded systems  Leverage the LatticeECP family’s sysDSP capability for multiply‑accumulate and signal-processing tasks in communications or sensor processing systems.
• Memory interface designs  Use the device in systems that require a dedicated DDR memory interface and flexible I/O standards.
• Industrial control and automation  Industrial-grade temperature range and robust packaging support deployment in temperature-challenging environments.

Unique Advantages

• High logic density: 10,200 logic elements enable implementation of medium-scale digital designs without excessive external logic.
• Balanced on-chip memory: Approximately 0.28 Mbits of on-chip RAM supports buffering, state storage and small data structures without external SRAM.
• Flexible interfacing: 195 I/Os in a compact fpBGA footprint simplify board routing and allow multiple interface standards.
• Designed for DSP tasks: Family-level sysDSP blocks provide high-performance multiply‑accumulate resources for signal processing workloads.
• Robust operating range: −40 °C to 100 °C specification and RoHS compliance support industrial deployments and regulatory compliance.
• Compact package: 256-FPBGA (17×17 mm) balances I/O count and PCB space for dense system designs.

Why Choose LFECP10E-3FN256I?

The LFECP10E-3FN256I positions itself as a practical choice for engineers seeking a mid-density FPGA from the LatticeECP family with DSP capability, substantial I/O, and on-chip memory in a compact 256-ball fpBGA package. Its industrial temperature rating, low-voltage core and family-level features—such as flexible I/O standards, dedicated DDR support and multiple PLLs—make it suitable for embedded systems, communications interfaces and other mainstream, cost-conscious designs.

Customers building systems that require predictable logic capacity, integrated memory resources and flexible interfacing will find this device a solid option that aligns with LatticeECP family design and tool support.

Request a quote or submit your RFQ to obtain pricing, lead times and availability for the LFECP10E-3FN256I. Our team can provide the production and ordering details you need to move your design forward.