LFECP10E-3Q208C

The LFECP10E-3Q208C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a balanced combination of logic density, embedded RAM, and I/O count suitable for commercial electronic designs.

Key device characteristics include 10,200 logic elements, approximately 0.283 Mbits of on-chip RAM, 147 I/O pins, a 208-BFQFP package footprint and a low-voltage supply range of 1.14 V to 1.26 V, all rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic – 10,200 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• Logic Array Blocks – 1,280 logic array blocks (LABs) available to structure and partition designs for predictable resource allocation.
• Embedded Memory – Approximately 0.283 Mbits (282,624 bits) of on-chip RAM to support buffering, FIFOs and small data storage without external memory.
• I/O Capacity – 147 dedicated I/O pins to support a wide range of peripheral interfaces and board-level signal routing.
• Power – Low-voltage operation with a supply range of 1.14 V to 1.26 V, enabling integration into power-constrained commercial platforms.
• Package and Mounting – Surface-mount 208-BFQFP package; supplier device package listed as 208-PQFP (28×28) for PCB footprint planning.
• Operating Range – Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Compliance – RoHS compliant for environmental and regulatory alignment in commercial product manufacturing.

Typical Applications

• Commercial Embedded Systems – Implement control logic and feature-rich processing in commercial equipment using the device’s 10,200 logic elements and integrated RAM.
• I/O-Intensive Interfaces – Leverage the 147 I/O pins to bridge multiple peripherals, sensors, or user-interface components on a single FPGA.
• On-Board Data Handling – Use the on-chip embedded memory for temporary buffering, packet storage, or protocol FIFOs without external RAM.

Unique Advantages

• Balanced logic and memory: 10,200 logic elements paired with approximately 0.283 Mbits of RAM enable a wide range of digital functions while minimizing external component needs.
• High I/O density: 147 I/O pins accommodate complex board-level connectivity and multiple concurrent interfaces.
• Low-voltage operation: 1.14 V to 1.26 V supply range helps reduce system power budget and simplifies power rail design in commercial products.
• Compact surface-mount package: 208-BFQFP (supplier: 208-PQFP 28×28) supports high-density PCB layouts and automated assembly processes.
• Commercial temperature rating: 0 °C to 85 °C suitability aligns with standard commercial product environments.
• RoHS compliant: Supports environmentally conscious manufacturing and supply chain requirements.

Why Choose LFECP10E-3Q208C?

The LFECP10E-3Q208C positions itself as a commercially graded ECP FPGA option offering a practical mix of logic capacity, embedded RAM and a high I/O count in a compact surface-mount package. Its low-voltage operation and RoHS compliance make it a pragmatic choice for mainstream commercial designs that require on-chip memory and substantial connectivity without relying on external components.

This device is well suited for design teams targeting scalable, cost-conscious commercial products that need flexible programmable logic and efficient on-board data handling. Its package and electrical characteristics support straightforward integration into established PCB assembly workflows.

Request a quote or submit an inquiry to obtain pricing and lead-time information for the LFECP10E-3Q208C and discuss volume availability for your next design.