LFECP10E-3QN208I

The LFECP10E-3QN208I is an ECP Field Programmable Gate Array (FPGA) IC offered in a 208-BFQFP package. It provides a mid-density programmable logic platform with 10,200 logic elements and 1,280 CLBs for implementing custom digital functions.

Designed for industrial-grade use, this device combines a 147-pin I/O count, approximately 0.28 Mbits of on-chip RAM, and a tight core voltage range (1.14 V to 1.26 V), making it suitable for systems that require defined environmental and electrical operating bounds.

Key Features

• Logic Capacity — 10,200 logic elements and 1,280 CLBs provide a mid-density fabric for implementing combinational and sequential logic.
• Embedded Memory — Approximately 0.28 Mbits (282,624 bits) of on-chip RAM for implementing buffers, FIFOs, and local data storage.
• I/O Count — 147 user I/O pins to interface with peripherals, sensors, and external logic.
• Power and Core Voltage — Specified core supply range of 1.14 V to 1.26 V for stable low-voltage operation.
• Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting for PCB assembly.
• Operating Conditions — Industrial-grade temperature rating from −40 °C to 100 °C for deployment in demanding ambient environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Mid-density programmable logic systems — Suitable for designs that require around 10k logic elements and 147 I/O for custom control and interfacing tasks.
• Embedded control in industrial equipment — Industrial-grade temperature range and surface-mount package fit into industrial control boards and modules.
• On-board data buffering and small-scale memory tasks — Approximately 0.28 Mbits of embedded RAM supports local data storage needs such as FIFOs and configuration buffers.

Unique Advantages

• Balanced logic and memory capacity: 10,200 logic elements paired with 282,624 bits of RAM provides a practical combination for mid-scale designs without excessive overhead.
• High I/O count: 147 user I/O pins enable broad peripheral connectivity and flexible board-level integration.
• Industrial temperature range: Rated from −40 °C to 100 °C to support more demanding environmental deployments.
• Compact surface-mount package: 208-BFQFP (208-PQFP, 28×28) allows dense PCB layouts while maintaining accessibility for assembly and test.
• Defined core voltage window: 1.14 V to 1.26 V supply specification supports consistent voltage planning and power-domain design.
• Regulatory compliance: RoHS-compliant construction for environments requiring restricted substance adherence.

Why Choose LFECP10E-3QN208I?

The LFECP10E-3QN208I positions itself as a mid-density, industrial-grade FPGA option that combines a clear set of electrical and environmental specifications with practical logic and memory resources. Its combination of 10,200 logic elements, 1,280 CLBs, and 147 I/O pins offers designers a predictable platform for embedded digital control, interface consolidation, and on-board data handling.

Engineers and procurement teams seeking a surface-mount FPGA with defined voltage and temperature boundaries will find this device suitable for designs that prioritize deterministic specifications, compact packaging, and regulatory compliance.

Request a quote or submit an inquiry today to discuss availability and pricing for the LFECP10E-3QN208I.