LFECP10E-4F484C

The LFECP10E-4F484C is an ECP field programmable gate array (FPGA) in a 484-ball BGA package designed for commercial applications. It provides 10,200 logic elements, approximately 0.28 Mbits of embedded RAM, and up to 288 general-purpose I/O pins in a surface-mount 23 × 23 mm FPBGA footprint.

With a low-voltage core supply range and a commercial temperature rating, this device targets designs that require moderate logic density, on-chip memory, and a compact, RoHS-compliant package.

Key Features

• Logic Capacity  10,200 logic elements suitable for mid-range programmable logic implementations.
• Embedded Memory  Approximately 0.28 Mbits (282,624 bits) of on-chip RAM to support buffering, lookup tables, and small memory structures.
• I/O Resources  288 user I/O pins to support multi-channel interfacing and external peripheral connections.
• Package and Mounting  484-ball BGA package (484-FPBGA, 23×23 mm) optimized for surface-mount assembly in space-constrained designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V for low-voltage system integration.
• Temperature and Grade  Commercial grade with an operating range from 0 °C to 85 °C.
• Regulatory  RoHS-compliant construction for adherence to common environmental requirements.

Typical Applications

• Commercial Embedded Systems  Use as a programmable logic element in commercial embedded products that require mid-range logic capacity and on-chip RAM.
• I/O-Intensive Designs  Suitable for systems that need a high count of general-purpose I/O lines for interfacing with multiple peripherals or sensors.
• Compact, Surface-Mount Implementations  Fits designs where board space and a surface-mount BGA package are key constraints while still providing substantial logic and memory resources.

Unique Advantages

• Substantial Logic Resources: 10,200 logic elements provide the capacity to implement complex programmable logic and custom functions without external gate arrays.
• On-Chip Memory: Approximately 0.28 Mbits of embedded RAM reduces the need for external memory in buffering and small data-storage tasks.
• High I/O Count: 288 I/O pins enable broad connectivity options for multi-channel and multi-peripheral designs.
• Compact BGA Package: 484-FPBGA (23×23 mm) packaging consolidates functionality into a small footprint for compact board layouts.
• Low-Voltage Core: 1.14 V to 1.26 V supply range supports integration into low-voltage system architectures.
• Commercial Temperature and RoHS Compliance: 0 °C to 85 °C rating and RoHS-compliant status align with common commercial manufacturing and environmental requirements.

Why Choose LFECP10E-4F484C?

The LFECP10E-4F484C balances logic capacity, embedded memory, and high I/O count within a compact 484-ball BGA package, making it well suited for commercial designs that require mid-range programmable logic and flexible interfacing. Its low-voltage core and surface-mount form factor help integrate the device into space- and power-constrained boards.

Choose this FPGA when your design requires a RoHS-compliant, commercial-grade programmable device with 10,200 logic elements, approximately 0.28 Mbits of internal RAM, and up to 288 I/O pins—providing a scalable, integrated option for a variety of embedded applications.

Request a quote or submit an inquiry to receive pricing and availability for the LFECP10E-4F484C.