LFECP10E-3QN208C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP |
|---|---|
| Quantity | 512 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFECP10E-3QN208C – ECP Field Programmable Gate Array (FPGA), 10,200 logic elements, 147 I/Os, 208-BFQFP
The LFECP10E-3QN208C is a LatticeECP-family field programmable gate array (FPGA) device offering 10,200 logic elements and extensive on-chip memory and I/O resources. It combines an efficient FPGA fabric with on-chip DSP and memory resources to address mainstream embedded and signal-processing designs.
Targeted at cost-sensitive, mainstream applications, this commercial-grade, surface-mount FPGA provides flexible I/O, dedicated system-level features and a compact 208-pin PQFP/BFQFP package suitable for high-density board designs.
Key Features
- Logic Capacity 10,200 logic elements for implementing mid-range logic and control functions in a single device.
- On-chip Memory Approximately 276 Kbits (282,624 bits) of on-chip RAM for embedded data buffering, state storage and small memories.
- DSP Resources (LatticeECP family) Family architecture includes dedicated sysDSP blocks (4 blocks for the LFEC10/LFECP10 class) designed for high-performance multiply-accumulate operations.
- I/O and Interface Flexibility 147 user I/Os and programmable sysI/O buffer options (family-level support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and related standards) to support a wide range of interfaces.
- Clocking Up to four analog PLLs per device (family-level capability) for clock multiplication, division and phase shifting.
- Memory Interface Family-level support for dedicated DDR memory interfaces (up to DDR400) for external memory connectivity.
- Power Core voltage supply range: 1.14 V to 1.26 V, aligning with the device’s 1.2 V VCC family-level requirement.
- Package & Mounting 208-pin BFQFP package (supplier device package listed as 208-PQFP, 28 × 28 mm), surface-mount mounting for compact PCB integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial applications.
- RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Embedded Systems Implement control logic, glue logic and custom peripherals where mid-range logic density and moderate on-chip memory suffice.
- Signal Processing / DSP Use the device’s dedicated sysDSP blocks and on-chip RAM for multiply-accumulate tasks, filters and real-time data processing pipelines.
- Communications & Networking Leverage flexible I/O standards and 147 user I/Os to implement protocol bridging, packet processing and DDR-attached buffering.
- Consumer & Industrial Electronics Integrate custom interfaces, user interfaces and control functions in compact, surface-mount designs within commercial temperature ranges.
Unique Advantages
- Balanced Logic and Memory 10,200 logic elements paired with approximately 276 Kbits of on-chip RAM provide a practical balance for mid-range designs without external memory for small data sets.
- Dedicated DSP Capability Family-level sysDSP blocks enable efficient hardware acceleration of multiply-accumulate workloads, reducing reliance on external DSPs.
- Flexible I/O Ecosystem 147 I/Os and family-supported programmable I/O standards allow integration with a wide variety of signaling standards and external devices.
- Compact PCB Footprint 208-pin BFQFP/PQFP packaging provides a high pin-count solution in a 28 × 28 mm footprint for space-constrained boards.
- System-Level Support Family features such as multiple PLLs and dedicated DDR interface support simplify clocking and external memory interfacing when required.
Why Choose LFECP10E-3QN208C?
The LFECP10E-3QN208C occupies a practical middle ground for designers needing a cost-effective FPGA with meaningful logic density, on-chip memory and DSP resources. Its combination of 10,200 logic elements, approximately 276 Kbits of RAM and 147 I/Os makes it suitable for mainstream embedded and signal-processing applications that require integration and interface flexibility in a compact 208-pin package.
Backed by the LatticeECP family architecture, this device provides system-level features such as multiple PLLs and dedicated DDR support, enabling scalable designs that benefit from the family’s toolchain and IP ecosystem.
Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the LFECP10E-3QN208C. Our team can provide technical details and procurement support to help you evaluate this device for your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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