LFECP10E-3QN208C

IC FPGA 147 I/O 208QFP
Part Description

ECP Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP

Quantity 512 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFECP10E-3QN208C – ECP Field Programmable Gate Array (FPGA), 10,200 logic elements, 147 I/Os, 208-BFQFP

The LFECP10E-3QN208C is a LatticeECP-family field programmable gate array (FPGA) device offering 10,200 logic elements and extensive on-chip memory and I/O resources. It combines an efficient FPGA fabric with on-chip DSP and memory resources to address mainstream embedded and signal-processing designs.

Targeted at cost-sensitive, mainstream applications, this commercial-grade, surface-mount FPGA provides flexible I/O, dedicated system-level features and a compact 208-pin PQFP/BFQFP package suitable for high-density board designs.

Key Features

  • Logic Capacity  10,200 logic elements for implementing mid-range logic and control functions in a single device.
  • On-chip Memory  Approximately 276 Kbits (282,624 bits) of on-chip RAM for embedded data buffering, state storage and small memories.
  • DSP Resources (LatticeECP family)  Family architecture includes dedicated sysDSP blocks (4 blocks for the LFEC10/LFECP10 class) designed for high-performance multiply-accumulate operations.
  • I/O and Interface Flexibility  147 user I/Os and programmable sysI/O buffer options (family-level support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and related standards) to support a wide range of interfaces.
  • Clocking  Up to four analog PLLs per device (family-level capability) for clock multiplication, division and phase shifting.
  • Memory Interface  Family-level support for dedicated DDR memory interfaces (up to DDR400) for external memory connectivity.
  • Power  Core voltage supply range: 1.14 V to 1.26 V, aligning with the device’s 1.2 V VCC family-level requirement.
  • Package & Mounting  208-pin BFQFP package (supplier device package listed as 208-PQFP, 28 × 28 mm), surface-mount mounting for compact PCB integration.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
  • RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Embedded Systems  Implement control logic, glue logic and custom peripherals where mid-range logic density and moderate on-chip memory suffice.
  • Signal Processing / DSP  Use the device’s dedicated sysDSP blocks and on-chip RAM for multiply-accumulate tasks, filters and real-time data processing pipelines.
  • Communications & Networking  Leverage flexible I/O standards and 147 user I/Os to implement protocol bridging, packet processing and DDR-attached buffering.
  • Consumer & Industrial Electronics  Integrate custom interfaces, user interfaces and control functions in compact, surface-mount designs within commercial temperature ranges.

Unique Advantages

  • Balanced Logic and Memory  10,200 logic elements paired with approximately 276 Kbits of on-chip RAM provide a practical balance for mid-range designs without external memory for small data sets.
  • Dedicated DSP Capability  Family-level sysDSP blocks enable efficient hardware acceleration of multiply-accumulate workloads, reducing reliance on external DSPs.
  • Flexible I/O Ecosystem  147 I/Os and family-supported programmable I/O standards allow integration with a wide variety of signaling standards and external devices.
  • Compact PCB Footprint  208-pin BFQFP/PQFP packaging provides a high pin-count solution in a 28 × 28 mm footprint for space-constrained boards.
  • System-Level Support  Family features such as multiple PLLs and dedicated DDR interface support simplify clocking and external memory interfacing when required.

Why Choose LFECP10E-3QN208C?

The LFECP10E-3QN208C occupies a practical middle ground for designers needing a cost-effective FPGA with meaningful logic density, on-chip memory and DSP resources. Its combination of 10,200 logic elements, approximately 276 Kbits of RAM and 147 I/Os makes it suitable for mainstream embedded and signal-processing applications that require integration and interface flexibility in a compact 208-pin package.

Backed by the LatticeECP family architecture, this device provides system-level features such as multiple PLLs and dedicated DDR support, enabling scalable designs that benefit from the family’s toolchain and IP ecosystem.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the LFECP10E-3QN208C. Our team can provide technical details and procurement support to help you evaluate this device for your next design.

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