LFECP10E-3FN484I

The LFECP10E-3FN484I is an industrial‑grade, surface‑mount FPGA optimized for mainstream embedded and industrial applications. It combines an FPGA fabric with dedicated DSP and memory resources to support compute‑intensive logic, high‑speed I/O, and integrated system functions.

Built on the Lattice ECP family architecture, this device targets applications that require moderate logic density, substantial on‑chip RAM, flexible I/O support and robust operating conditions, while operating from a low core supply voltage.

Key Features

• Logic Capacity — 10,200 logic elements suitable for mid‑density FPGA designs and complex glue logic or control tasks.
• On‑chip Memory — Approximately 282,624 bits (≈276 Kbits) of embedded RAM for buffering, FIFOs and small data stores within the fabric.
• DSP Capability (sysDSP) — Family DSP architecture provides dedicated multiply/accumulate resources for signal processing and arithmetic acceleration.
• I/O Flexibility — 288 user I/Os supported in the 484‑ball package; family I/O buffer options include LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS and related standards.
• Clocking — Up to four analog PLLs to support clock multiplication, division and phase shifting for complex timing domains.
• Power — Core supply range from 1.14 V to 1.26 V to support low‑voltage system architectures.
• Package & Mounting — 484‑BBGA (484‑FPBGA, 23 × 23 mm) ball grid array in a surface‑mount form factor for board‑level integration.
• Operating Range & Grade — Industrial temperature operation from −40 °C to 100 °C and RoHS‑compliant construction for regulatory alignment.

Typical Applications

• Industrial Control: Implement real‑time control logic, protocol bridging and factory automation functions that require industrial temperature range and reliable I/O density.
• Communications & Networking: Use the device for packet processing, protocol adaptation and medium‑speed interface handling leveraging flexible I/O standards and PLLs.
• Embedded Signal Processing: Accelerate DSP functions and arithmetic workloads using on‑die sysDSP blocks and embedded RAM for temporary storage.
• High‑density I/O Systems: Integrate multiple peripheral interfaces and custom bus conversions where a high count of user I/Os and a compact BGA package are required.

Unique Advantages

• Balanced Logic and Memory: 10,200 logic elements combined with roughly 276 Kbits of embedded RAM provides a practical mix for control, buffering and mid‑range logic designs.
• Dedicated DSP Resources: Built‑in sysDSP blocks enable efficient multiply/accumulate operations without consuming general logic, reducing design complexity for signal tasks.
• Flexible Interface Support: Family I/O buffer options cover common single‑ended and differential signaling standards, simplifying board‑level integration with diverse peripherals.
• Multiple PLLs: Up to four PLLs allow independent clock domain generation and phase control for multi‑domain systems and memory interfaces.
• Industrial Reliability: Specified operation from −40 °C to 100 °C and surface‑mount 484‑BBGA packaging meet common industrial deployment requirements.
• Low‑Voltage Core: Narrow core supply window (1.14–1.26 V) supports power‑sensitive designs and consistent voltage planning across platforms.

Why Choose LFECP10E-3FN484I?

The LFECP10E-3FN484I positions itself as a practical, mid‑density FPGA option for engineers who need a strong combination of logic capacity, on‑chip memory and DSP capability in an industrial‑rated package. Its flexible I/O options and multiple PLLs make it suitable for embedded systems that require diverse interfaces and precise clock control.

This device is well suited to development and volume deployments where predictable operating temperature range, RoHS compliance and a compact 484‑ball BGA footprint are priorities, providing a scalable solution within the Lattice ECP family architecture.

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