LFECP10E-3FN256C

The LFECP10E-3FN256C is a commercial-grade Lattice Semiconductor ECP-series FPGA delivering a balanced mix of logic, embedded memory, DSP capability and flexible I/O in a compact 256-ball fpBGA package. Designed for mainstream, cost-sensitive applications, this device targets designs that require moderate logic density, on-chip RAM and high I/O count while operating at a low core voltage.

Key on-chip resources include 10,200 logic elements, approximately 0.283 Mbits of embedded RAM, 195 I/Os, and dedicated DSP and clock resources drawn from the LatticeECP family architecture.

Key Features

• Core Logic — 10,200 logic elements for implementing combinational and sequential functions and mid-density FPGA designs.
• Embedded Memory — Total on-chip RAM of 282,624 bits (approximately 0.283 Mbits) to support buffering, state storage and small on-chip data structures.
• DSP Resources — sysDSP blocks (family feature for LatticeECP) providing high-performance multiply‑accumulate capability; device-level allocation corresponds to the LFECP10 family configuration.
• Clocking — Up to four analog PLLs per device to enable clock generation, multiply/divide and phase shifting for complex timing domains.
• Flexible I/O — 195 I/Os available in the 256-ball fpBGA package to support multi‑lane interfaces and broad system connectivity options.
• Package & Mounting — 256-FPBGA (17 × 17 mm) surface-mount package for compact system integration and high-density board layouts.
• Power — Core voltage supply range: 1.14 V to 1.26 V, compatible with 1.2 V system power architectures.
• Temperature & Grade — Commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Digital Signal Processing and Accelerators — Use the on-chip sysDSP blocks and embedded RAM to offload multiply‑accumulate workloads and implement algorithmic pipelines.
• Memory Interface and Controller Logic — Dedicated DDR memory support in the family enables implementation of DDR interfaces and associated control logic.
• High‑I/O System Glue Logic — With 195 I/Os in a compact 256‑fpBGA, the device is suited for board-level interface aggregation, protocol bridging and multi‑lane connectivity.
• Cost‑Sensitive Mainstream Designs — Optimized for mainstream applications where an efficient mix of logic, memory and DSP reduces system BOM and footprint.

Unique Advantages

• Balanced resource set: 10,200 logic elements plus substantial on-chip RAM provide a practical balance of compute and storage for mid-density designs.
• Dedicated DSP capability: sysDSP blocks accelerate arithmetic-heavy functions, enabling efficient implementation of signal processing and filtering tasks.
• Compact, high‑I/O package: 256‑fpBGA (17 × 17 mm) delivers 195 I/Os in a small footprint to simplify board routing and reduce PCB area.
• Flexible clocking: Up to four analog PLLs allow precise clock domain management and phase/timing adjustments for multi‑clock systems.
• Low‑voltage operation: Operates within a 1.14 V–1.26 V supply window to align with modern low‑voltage system designs.
• Compliance and manufacturability: Surface-mount 256‑FPBGA package and RoHS compliance support contemporary manufacturing flows and environmental requirements.

Why Choose LFECP10E-3FN256C?

The LFECP10E-3FN256C positions itself as a pragmatic choice for designers who need a mid-density FPGA with a strong mix of logic, embedded RAM and DSP capability in a compact package. Its 10,200 logic elements, approximately 0.283 Mbits of on-chip RAM and 195 I/Os make it suitable for system glue logic, memory interfacing, and DSP-accelerated processing in cost-sensitive applications.

As part of the LatticeECP family, the device benefits from dedicated DSP blocks, multiple PLLs and family-level features that simplify implementation of timing-critical and memory-interfacing functions, offering a scalable platform for development and deployment in mainstream electronic systems.

Request a quote or submit a purchase inquiry to learn pricing, lead times and availability for the LFECP10E-3FN256C. Our team can provide the product details and support needed to evaluate this FPGA for your design.