LFECP10E-3FN484C

The LFECP10E-3FN484C is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, implemented in the LatticeECP family. It combines programmable logic resources, on-chip memory, and high I/O density in a compact 484-ball BGA package for mainstream embedded and system applications.

With 10,200 logic elements, approximately 282,624 bits of embedded RAM, and 288 user I/Os, this device targets applications requiring balanced logic capacity, on-chip memory and flexible I/O in a commercial-temperature, surface-mount package. The device operates from a core supply of 1.14 V to 1.26 V and is RoHS compliant.

Key Features

• Logic Capacity — 10,200 logic elements and 1,280 logic blocks provide programmable fabric suitable for medium-density designs.
• On‑chip Memory — Approximately 282,624 bits of embedded RAM to support buffering, FIFOs and local data storage.
• I/O Density — 288 user I/Os to support broad interfacing requirements in a single device.
• Package and Mounting — 484-ball fpBGA (484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board-level integration.
• Voltage Supply — Core supply range of 1.14 V to 1.26 V for compatibility with system power domains.
• Operating Temperature — Commercial temperature grade, 0 °C to 85 °C.
• Series-level System Features — LatticeECP family capabilities include dedicated sysDSP blocks for high-performance multiply/accumulate, dedicated DDR memory interface support, up to four analog PLLs, and flexible sysI/O buffers supporting a wide range of I/O standards.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Signal processing and DSP acceleration — Use the device’s logic and on-chip RAM alongside family sysDSP capabilities to implement multiply/accumulate and filtering functions.
• Memory interface and controllers — Implement DDR interface logic and memory controllers leveraging the family’s dedicated DDR support and on-chip resources.
• Protocol bridging and high-density I/O — 288 I/Os and flexible I/O buffer options support protocol translation, bus bridging and multi‑lane interfaces in communications and connectivity modules.
• Embedded system glue logic — Integrate control, interfacing and custom logic in compact systems where on‑chip memory and programmable fabric reduce external component count.

Unique Advantages

• Balanced logic and memory — Combines 10,200 logic elements with approximately 282,624 bits of RAM to handle mid‑range logic and buffering needs without excessive external memory.
• High I/O count in a compact footprint — 288 I/Os in a 23 × 23 mm 484-FPBGA package offers dense interfacing while conserving PCB area.
• Low-voltage core operation — Core supply range (1.14–1.26 V) aligns with modern system power rails for efficient integration.
• Commercial temperature suitability — Rated 0 °C to 85 °C for mainstream embedded and consumer applications.
• Series-level design ecosystem — LatticeECP family support includes design tools and pre‑designed IP modules that streamline development and migration within the family.
• Regulatory readiness — RoHS compliance supports environmental and manufacturing requirements.

Why Choose LFECP10E-3FN484C?

The LFECP10E-3FN484C positions itself as a versatile mid-density FPGA offering from the LatticeECP family, delivering a balanced mix of programmable logic, embedded memory and high I/O count in a compact 484-ball BGA package. Its commercial temperature rating, low core voltage range and RoHS compliance make it well suited for mainstream embedded, communications and control designs that require on-chip memory and flexible interfacing.

Designers benefit from the LatticeECP series-level ecosystem—available design tools and ispLeverCORE IP blocks—facilitating faster development and potential migration across devices in the family as project requirements evolve.

Request a quote or contact sales to discuss availability, pricing and lead time for the LFECP10E-3FN484C.