LFECP10E-3F484I

The LFECP10E-3F484I is an ECP-class field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a balanced combination of programmable logic, on-chip memory and I/O resources in a compact ball-grid array package for system-level integration.

Targeted at applications that require configurable logic and robust operation, this device delivers 10,200 logic elements, 282,624 bits of embedded memory and 288 I/O pins while supporting industrial operating temperatures and surface-mount packaging.

Key Features

• Core Logic 10,200 logic elements for implementing custom digital functions and state machines.
• Embedded Memory Approximately 0.283 Mbits of on-chip RAM (282,624 bits) to support buffering, FIFOs and small data tables.
• I/O Resources 288 general-purpose I/O pins to interface with peripherals, sensors and other system components.
• Package & Mounting 484-ball BGA package (supplier package: 484-FPBGA, 23×23) with surface-mount construction for compact PCB integration.
• Power Core voltage supply range from 1.14 V to 1.26 V to match low-voltage system designs.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance RoHS-compliant for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Deploy custom control logic and I/O handling in systems that require industrial temperature operation.
• Interface Bridging — Implement protocol translation and signal conditioning using flexible I/O and embedded logic resources.
• Prototyping & Development — Use programmable logic capacity and on-chip RAM for hardware validation and iterative design.
• Embedded System Integration — Consolidate glue logic and peripheral management into a single FPGA to reduce component count.

Unique Advantages

• Substantial Logic Capacity: 10,200 logic elements provide room for complex finite-state machines, custom accelerators and glue logic.
• Generous I/O Count: 288 I/O pins enable broad peripheral connectivity without external multiplexers.
• On-Chip Memory: Approximately 0.283 Mbits of embedded RAM supports buffering, small lookup tables and data staging.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environments.
• Compact Surface-Mount Package: 484-BBGA (23×23) footprint saves PCB area while providing a high pin count.
• Low-Voltage Core: 1.14 V–1.26 V supply range aligns with modern low-voltage system domains.

Why Choose LFECP10E-3F484I?

The LFECP10E-3F484I combines a balanced logic fabric, meaningful embedded memory and a high I/O count in a compact 484-ball BGA, making it a practical choice for designs that require configurable logic within an industrial temperature envelope. Its specifications suit engineers and procurement teams seeking a configurable IC from Lattice Semiconductor Corporation that supports robust operation and broad connectivity.

This device is well suited to projects that need scalable programmable logic, moderate on-chip memory and extensive I/O while maintaining surface-mount assembly and RoHS compliance, helping to simplify bill-of-materials and PCB design trade-offs.

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