LFECP10E-4F484I

The LFECP10E-4F484I is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation delivering 10,200 logic elements with approximately 0.283 Mbits of embedded RAM and 288 general-purpose I/O. This device is supplied in a 484-ball BGA package and is specified for industrial-grade use with an extended operating temperature range.

With a low nominal core supply range and compact BGA footprint, the part addresses designs that require medium logic density, substantial I/O count, and reliable operation across -40 °C to 100 °C.

Key Features

• Core and Logic  10,200 logic elements and 1,280 CLBs provide the programmable fabric for custom digital logic and control functions.
• Embedded Memory  Approximately 0.283 Mbits of on-chip RAM to support buffering, small lookup tables, and local data storage.
• I/O Capacity  288 user I/O pins allow for broad connectivity to peripherals, sensors, and external interfaces.
• Power  Operates from a core supply range of 1.14 V to 1.26 V to match low-voltage system requirements.
• Package and Mounting  484-ball BGA package (supplier device package: 484-FPBGA, 23 × 23) designed for surface-mount assembly to support high-density board layouts.
• Environmental and Reliability  Industrial grade with an operating temperature range of -40 °C to 100 °C and RoHS compliance for regulatory and sustainability alignment.

Typical Applications

• Industrial Control Systems  Leverages industrial temperature rating and 288 I/O to implement control logic, monitoring, and I/O aggregation in industrial equipment.
• Embedded Processing  Uses 10,200 logic elements and on-chip RAM for custom processing tasks, protocol handling, and glue logic in embedded platforms.
• High-Density I/O Interfaces  288 I/O in a compact 484-BBGA package supports designs requiring extensive signal routing in constrained PCB real estate.

Unique Advantages

• Substantial Logic Capacity: 10,200 logic elements enable implementation of complex digital functions without external RTL partitioning.
• Balanced On-Chip Memory: Approximately 0.283 Mbits of embedded RAM provides local storage for buffering and state retention.
• High I/O Count: 288 I/O pins reduce the need for external I/O expanders and simplify board-level integration.
• Industrial Temperature Operation: Rated from -40 °C to 100 °C for reliable performance in thermally demanding environments.
• Compact BGA Footprint: 484-ball FPBGA (23 × 23) supports dense board layouts while maintaining surface-mount compatibility.
• RoHS Compliant: Environmentally compliant manufacturing to meet regulatory and corporate sustainability requirements.

Why Choose LFECP10E-4F484I?

The LFECP10E-4F484I combines a mid-range logic fabric, meaningful on-chip memory, and a high I/O count in a compact 484-ball BGA package, making it a practical choice for industrial-grade embedded designs. Its low-voltage operation and extended temperature rating support reliable deployment in systems that require stable operation across varying conditions.

This FPGA is well-suited for engineering teams seeking to consolidate control and interfacing functions into a single programmable device while maintaining board-density efficiency and regulatory compliance.

Request a quote today to check availability and pricing for the LFECP10E-4F484I and to discuss how it can fit your design requirements.