LFECP10E-4FN484I

IC FPGA 288 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 288 282624 10200 484-BBGA

Quantity 17 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O288Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFECP10E-4FN484I – ECP Field Programmable Gate Array (FPGA) IC, 288 I/O, 484-BBGA

The LFECP10E-4FN484I is an industrial-grade LatticeECP-series FPGA delivering 10,200 logic elements in a compact 484-ball BBGA (23 × 23 mm) package. Designed for mainstream embedded and system-level applications, it combines a dense logic fabric with on-chip memory, DSP resources and flexible I/O to accelerate signal processing, interface bridging and control functions.

Its combination of 288 I/Os, dedicated DSP blocks, multiple PLLs and support for common high-speed I/O standards makes it suitable for designs that require performance, integration and a broad set of interface options in a surface-mount form factor.

Key Features

  • Core Logic  10,200 logic elements provide a balanced fabric for implementing control, glue logic and moderate-density custom logic blocks.
  • On-chip Memory  Approximately 282,624 bits (≈0.28 Mbits) of total on-chip RAM for distributed and block memory needs within your design.
  • DSP Acceleration  sysDSP blocks included for high-performance multiply-and-accumulate operations; device-level resources support DSP-oriented workloads.
  • Clocking  Up to four analog PLLs enable flexible clock multiply, divide and phase-shift functions for multi-domain designs.
  • Flexible I/O Support  Programmable sysI/O buffer supports a wide range of interfaces and voltage standards, including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI and differential standards such as LVDS and LVPECL.
  • Dedicated DDR Memory Support  On-chip logic implements interfaces up to DDR400 (200 MHz) for external memory connectivity where needed.
  • Power  Core supply voltage range 1.14 V to 1.26 V (nominal 1.2 V), enabling integration with modern low-voltage power rails.
  • Package & Mounting  484-ball FBGA (23 × 23 mm) surface-mount package with 288 user I/Os, offering a compact, routable footprint for dense board designs.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suited to industrial environments and extended-temperature applications.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control  Motor control, PLC interfacing and factory-automation tasks that require reliable logic, I/O density and operation over an extended temperature range.
  • Signal Processing  Real-time DSP functions using on-chip sysDSP blocks for filtering, aggregation and pre-processing of sensor or communications data.
  • Interface Bridging  Protocol translation and I/O consolidation between legacy and modern interfaces using the device’s flexible programmable I/O.
  • Embedded System Glue Logic  Integration of custom control state machines, bus arbitration and timing-critical logic in compact designs with limited board space.

Unique Advantages

  • Balanced integration: Combines 10,200 logic elements with embedded RAM and DSP resources to reduce external components and simplify BOM.
  • Wide I/O flexibility: Programmable sysI/O supports multiple voltage standards and differential interfaces, enabling broad system connectivity without external level shifters.
  • Deterministic clocking: Multiple PLLs provide per-domain clocking flexibility for multi-rate and phase-sensitive designs.
  • Industrial robustness: −40 °C to 100 °C operating range and surface-mount FBGA packaging suit demanding embedded and industrial deployments.
  • Low-voltage core compatibility: Narrow core supply window around 1.2 V simplifies power-supply design for modern low-voltage systems.
  • RoHS compliant: Meets environmental requirements for lead-free assembly processes.

Why Choose LFECP10E-4FN484I?

The LFECP10E-4FN484I occupies a practical point in the LatticeECP family, delivering a strong mix of programmable logic, on-chip memory and DSP capability in a compact 484-ball BGA. It is aimed at designers who need a flexible, industrial-temperature FPGA with extensive I/O options and deterministic clocking for embedded processing, interface bridging and control tasks.

Choosing this device supports scalable design approaches: it provides integrated resources that reduce external components, accelerates signal-processing tasks with dedicated DSP blocks, and offers the I/O adaptability required to connect diverse subsystems—helping shorten development time and simplify system integration.

If you would like to request a quote or submit a purchasing inquiry for LFECP10E-4FN484I, please request a quote or contact sales through your usual procurement channels.

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