LFECP10E-4FN484I
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 288 282624 10200 484-BBGA |
|---|---|
| Quantity | 17 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 288 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFECP10E-4FN484I – ECP Field Programmable Gate Array (FPGA) IC, 288 I/O, 484-BBGA
The LFECP10E-4FN484I is an industrial-grade LatticeECP-series FPGA delivering 10,200 logic elements in a compact 484-ball BBGA (23 × 23 mm) package. Designed for mainstream embedded and system-level applications, it combines a dense logic fabric with on-chip memory, DSP resources and flexible I/O to accelerate signal processing, interface bridging and control functions.
Its combination of 288 I/Os, dedicated DSP blocks, multiple PLLs and support for common high-speed I/O standards makes it suitable for designs that require performance, integration and a broad set of interface options in a surface-mount form factor.
Key Features
- Core Logic 10,200 logic elements provide a balanced fabric for implementing control, glue logic and moderate-density custom logic blocks.
- On-chip Memory Approximately 282,624 bits (≈0.28 Mbits) of total on-chip RAM for distributed and block memory needs within your design.
- DSP Acceleration sysDSP blocks included for high-performance multiply-and-accumulate operations; device-level resources support DSP-oriented workloads.
- Clocking Up to four analog PLLs enable flexible clock multiply, divide and phase-shift functions for multi-domain designs.
- Flexible I/O Support Programmable sysI/O buffer supports a wide range of interfaces and voltage standards, including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI and differential standards such as LVDS and LVPECL.
- Dedicated DDR Memory Support On-chip logic implements interfaces up to DDR400 (200 MHz) for external memory connectivity where needed.
- Power Core supply voltage range 1.14 V to 1.26 V (nominal 1.2 V), enabling integration with modern low-voltage power rails.
- Package & Mounting 484-ball FBGA (23 × 23 mm) surface-mount package with 288 user I/Os, offering a compact, routable footprint for dense board designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suited to industrial environments and extended-temperature applications.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Motor control, PLC interfacing and factory-automation tasks that require reliable logic, I/O density and operation over an extended temperature range.
- Signal Processing Real-time DSP functions using on-chip sysDSP blocks for filtering, aggregation and pre-processing of sensor or communications data.
- Interface Bridging Protocol translation and I/O consolidation between legacy and modern interfaces using the device’s flexible programmable I/O.
- Embedded System Glue Logic Integration of custom control state machines, bus arbitration and timing-critical logic in compact designs with limited board space.
Unique Advantages
- Balanced integration: Combines 10,200 logic elements with embedded RAM and DSP resources to reduce external components and simplify BOM.
- Wide I/O flexibility: Programmable sysI/O supports multiple voltage standards and differential interfaces, enabling broad system connectivity without external level shifters.
- Deterministic clocking: Multiple PLLs provide per-domain clocking flexibility for multi-rate and phase-sensitive designs.
- Industrial robustness: −40 °C to 100 °C operating range and surface-mount FBGA packaging suit demanding embedded and industrial deployments.
- Low-voltage core compatibility: Narrow core supply window around 1.2 V simplifies power-supply design for modern low-voltage systems.
- RoHS compliant: Meets environmental requirements for lead-free assembly processes.
Why Choose LFECP10E-4FN484I?
The LFECP10E-4FN484I occupies a practical point in the LatticeECP family, delivering a strong mix of programmable logic, on-chip memory and DSP capability in a compact 484-ball BGA. It is aimed at designers who need a flexible, industrial-temperature FPGA with extensive I/O options and deterministic clocking for embedded processing, interface bridging and control tasks.
Choosing this device supports scalable design approaches: it provides integrated resources that reduce external components, accelerates signal-processing tasks with dedicated DSP blocks, and offers the I/O adaptability required to connect diverse subsystems—helping shorten development time and simplify system integration.
If you would like to request a quote or submit a purchasing inquiry for LFECP10E-4FN484I, please request a quote or contact sales through your usual procurement channels.

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