LFECP10E-4Q208C

The LFECP10E-4Q208C is a commercial-grade ECP Field Programmable Gate Array (FPGA) provided in a 208-BFQFP (208-PQFP 28×28) surface-mount package. It integrates a substantial logic fabric and on-chip memory with a broad complement of I/O to support programmable logic tasks in commercial embedded applications.

With 10,200 logic elements, approximately 0.28 Mbits of embedded RAM, and up to 147 I/O pins, this device is suited for designs that require flexible programmable logic, significant I/O connectivity, and low-voltage operation within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity – 10,200 logic elements and 1,280 CLBs provide a sizable programmable fabric for implementing custom logic, state machines, and glue-logic functions.
• Embedded Memory – Approximately 0.28 Mbits (282,624 bits) of on-chip RAM to support buffering, FIFOs, and small data structures directly on the FPGA.
• I/O Resources – Up to 147 I/O pins to interface with peripherals, sensors, buses, and other system components.
• Power – Low-voltage core operation with a supply range of 1.14 V to 1.26 V for optimized power profiles in modern systems.
• Package & Mounting – 208-BFQFP (supplier package 208-PQFP 28×28) in a surface-mount form factor to support compact PCB layouts.
• Commercial Temperature Range – Rated for operation from 0 °C to 85 °C, suitable for standard commercial-environment applications.
• RoHS Compliant – Meets RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

• Commercial Embedded Systems – Implement custom control logic, protocol bridging, and interface glue in consumer or office electronics operating within commercial temperature ranges.
• I/O-Intensive Controllers – Use the device’s 147 I/O pins for sensor aggregation, peripheral management, and multi-interface control in mid-complexity systems.
• Prototyping and Development – Deploy the FPGA for proof-of-concept designs and feature validation where reprogrammable logic and moderate memory are needed.
• Compact PCB Designs – Leverage the 208-BFQFP surface-mount package for space-constrained boards that require integrated programmable logic.

Unique Advantages

• High Logic Density: 10,200 logic elements enable a wide range of logic functions and moderate complexity designs without external glue logic.
• Integrated On-Chip RAM: Approximately 0.28 Mbits of embedded memory reduces reliance on external RAM for buffering and small data storage.
• Extensive I/O Count: 147 I/O pins allow direct interfacing to numerous peripherals and buses, simplifying board-level connectivity.
• Low-Voltage Core Operation: 1.14 V to 1.26 V supply range supports designs targeting lower power consumption and modern power-rail architectures.
• Compact Surface-Mount Package: 208-BFQFP (28×28 PQFP) balances pin count and board footprint for dense PCB layouts.
• Commercial Deployment Ready: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.

Why Choose LFECP10E-4Q208C?

The LFECP10E-4Q208C delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact surface-mount package designed for commercial applications. Its low-voltage operation and RoHS compliance make it a practical choice for developers building mid-complexity programmable logic into space-constrained designs.

This FPGA is well suited to engineers and procurement teams seeking a scalable, reprogrammable building block for embedded systems, interface controllers, and prototype development where predictable commercial-grade operation and integration are key.

Request a quote or submit a pricing inquiry today to get availability and pricing information for LFECP10E-4Q208C.