LFECP10E-4FN256I

The LFECP10E-4FN256I is an ECP family FPGA from Lattice Semiconductor Corporation, optimized for mainstream embedded and signal-processing applications. It combines programmable logic—10,200 logic elements and 1,280 CLB-equivalents—with approximately 282,624 bits of on-chip RAM and up to 195 I/Os to support complex, I/O-rich designs.

With industrial-grade operation from −40°C to 100°C and a low-voltage supply range of 1.14 V to 1.26 V, this 256-ball fpBGA (17 × 17 mm) device is designed for systems requiring dense logic, embedded memory, and flexible interfacing in a compact package.

Key Features

• Programmable Logic: 10,200 logic elements and 1,280 CLB-equivalents provide a balanced fabric for implementing control, glue logic, and medium-complexity algorithms.
• Embedded Memory: Approximately 282,624 bits of on-chip RAM (≈276 Kbits) for distributed and block memory needs within the FPGA fabric.
• Dedicated DSP Capability (Family): LatticeECP family architecture includes sysDSP blocks for high-performance multiply–accumulate operations, enabling efficient signal-processing implementations.
• I/O Density and Flexibility: 195 available I/Os support extensive external interfacing and system integration in I/O-intensive applications.
• Package & Mounting: 256-ball fpBGA package (17 × 17 mm), surface-mount mounting for compact board-level integration.
• Power and Clocking: Operates from 1.14 V to 1.26 V supply; family-level features include multiple analog PLLs for clock multiply/divide and phase shifting.
• Industrial Temperature Grade: Rated for operation from −40°C to 100°C for deployed industrial environments.
• RoHS Compliant: Meets RoHS environmental requirements.

Typical Applications

• Industrial Control: Implement control logic, sensor interfaces, and motor-control front ends where industrial temperature operation and compact packaging are required.
• High-Speed Signal Processing: Leverage the family’s DSP resources and on-chip RAM for filtering, FFTs, and real-time data processing tasks.
• Memory Interface and Buffering: Use embedded RAM and dedicated DDR interface support (family capability) for buffering and memory controller logic.
• I/O-Rich System Glue Logic: Integrate multiple peripherals and high-pin-count interfaces with the device’s 195 I/Os in space-constrained designs.

Unique Advantages

• Balanced Logic and Memory: 10,200 logic elements paired with ~282,624 bits of embedded memory enable mixed control and data-path designs without large external memory needs.
• Compact, High-Density Package: 256-ball fpBGA (17 × 17 mm) delivers high functionality in a small footprint for board-space-sensitive applications.
• Industrial Reliability: Specified operation from −40°C to 100°C supports deployment in harsh and industrial environments.
• Low-Voltage Operation: Narrow supply range (1.14–1.26 V) supports power-optimized system designs and predictable supply management.
• Flexible Clocking and DSP Support (Family): Family-level PLLs and sysDSP blocks simplify implementation of high-performance timing and signal-processing functions.
• Environmental Compliance: RoHS compliance helps meet regulatory and sourcing requirements.

Why Choose LFECP10E-4FN256I?

The LFECP10E-4FN256I positions itself as a capable, industrial-grade FPGA option when you need a compact package with a balanced combination of logic density, embedded memory, and extensive I/O. Its specification set supports designers building medium-complexity control, signal-processing, and I/O-centric systems while maintaining predictable power and thermal margins.

This device is well suited for engineering teams focused on scalable designs within the LatticeECP family, offering migration paths and family-level capabilities such as dedicated DSP blocks and flexible clocking to meet evolving performance and integration requirements.

Request a quote or submit an inquiry to evaluate the LFECP10E-4FN256I for your next embedded or industrial design project.