LFECP10E-4Q208I

The LFECP10E-4Q208I is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for embedded and industrial applications. It integrates 10,200 logic elements, approximately 0.28 Mbits of on-chip RAM, and a high I/O count to support mid-density programmable logic use cases.

With an industrial temperature grade, a wide operating range and a compact 208-BFQFP package, this FPGA is intended for designs that require substantial logic density, flexible I/O connectivity, and reliable operation across -40 °C to 100 °C.

Key Features

• Core Logic  10,200 logic elements provide programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.28 Mbits of on-chip RAM (282,624 bits) for buffering, look-up tables, and small local storage needs.
• I/O Capacity  147 I/Os to support dense peripheral interfacing, multi-channel signals, and bus bridging within a single device.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, enabling integration into low-voltage power domains.
• Package  208-BFQFP (208-PQFP 28×28 footprint) surface-mount package for compact PCB layouts and automated assembly.
• Industrial Grade & Temperature  Rated for industrial operation with an operating temperature range of -40 °C to 100 °C.
• Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Implement real-time control logic, state machines, and I/O handling for factory automation and control equipment within industrial temperature ranges.
• Interface Bridging  Aggregate and translate signals between multiple buses and peripherals using the device’s large I/O count and programmable logic.
• Data Acquisition  Perform front-end digitization, buffering and preprocessing where embedded RAM and programmable logic handle streaming data before transfer to host systems.
• Embedded Processing and Glue Logic  Replace discrete logic and CPLDs with a single FPGA to consolidate glue logic, timing control and custom processing functions.

Unique Advantages

• Substantial Logic Density: 10,200 logic elements enable implementation of complex state machines, protocol handlers and custom datapaths without multiple chips.
• Significant On-Chip Memory: Approximately 0.28 Mbits of embedded RAM reduces dependence on external memory for buffering and LUT storage.
• High I/O Count: 147 I/Os simplify designs that require many external connections, minimizing the need for additional multiplexers or expanders.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to support deployment in demanding environments.
• Compact Surface-Mount Package: 208-BFQFP packaging supports dense PCB layouts and automated assembly processes for production designs.
• RoHS Compliant: Meets common environmental manufacturing requirements for lead-free assembly.

Why Choose LFECP10E-4Q208I?

The LFECP10E-4Q208I delivers a balanced combination of programmable logic density, on-chip memory and connectivity in a compact industrial-grade package. It is well suited to designers who need a single-device solution for mid-range embedded and industrial control tasks where robust temperature performance and a high I/O count matter.

As an FPGA from Lattice Semiconductor Corporation, this device provides a predictable, component-level building block that supports consolidation of discrete logic, improved board-level integration, and long-term deployment in industrial environments.

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