LFECP10E-4QN208I

The LFECP10E-4QN208I is an ECP-family Field Programmable Gate Array (FPGA) in a 208-pin BFQFP surface-mount package. It delivers approximately 10,200 logic elements and roughly 0.283 Mbits of on-chip embedded RAM in an industrial-grade device rated from −40 °C to 100 °C.

Designed for mainstream embedded and DSP-capable designs, this device offers a balance of logic density, on-chip memory and I/O count for applications that require moderate integration and industrial temperature range operation. The device operates from a core supply between 1.14 V and 1.26 V and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 10,200 logic elements, providing a solid fabric for mid-density FPGA designs.
• On‑chip Memory  About 282,624 bits (~0.283 Mbits) of embedded RAM to support data buffering, state storage and local memory requirements.
• I/O Count  147 general-purpose I/O pins in a 208-pin BFQFP package to support broad peripheral and bus interfacing needs.
• Package & Mounting  208‑BFQFP (28 × 28 mm PQFP style) surface-mount package for PCB assembly in compact footprints where a PQFP is preferred.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Supply Voltage  Core supply specified from 1.14 V to 1.26 V for predictable power characteristics.
• Family Capabilities (LatticeECP)  As part of the LatticeECP family, the device aligns with family features such as sysDSP blocks, flexible I/O and multiple PLLs for clock management, enabling DSP and system-level designs (refer to family datasheet for full details).
• Standards & Compliance  RoHS compliant for environmental and regulatory conformance in assembly and production.

Typical Applications

• Industrial Control  Logic integration and I/O aggregation in industrial automation, controllers and instrumentation systems that require industrial temperature operation.
• DSP‑Enabled Embedded Systems  Mid-density DSP and control functions where on-chip RAM and FPGA logic are used for signal processing, filtering or data aggregation.
• Memory Interface and Bus Bridging  Implementing custom interfaces, buffering and protocol adaptation with available on-chip RAM and high I/O count.
• General Embedded Logic  Consolidating glue logic, state machines and custom peripherals in compact PQFP packaging for cost-sensitive embedded designs.

Unique Advantages

• Balanced Logic and Memory  Combines ~10,200 logic elements with ~0.283 Mbits of embedded RAM, enabling reasonably complex designs without external SRAM for many use cases.
• High I/O Density in PQFP  147 I/Os in a 208‑pin BFQFP provides extensive peripheral connectivity while preserving a low-profile PQFP package option.
• Industrial Temperature Rating  Operation from −40 °C to 100 °C reduces design risk for industrial deployments and extended-range applications.
• Family-Level DSP and Clock Resources  Access to LatticeECP family features such as dedicated DSP blocks and multiple PLLs supports higher-level system functions and clocking flexibility (see family datasheet for specifics).
• RoHS Compliant  Meets lead-free and other environmental requirements for modern manufacturing and assembly flows.

Why Choose LFECP10E-4QN208I?

The LFECP10E-4QN208I positions itself as a practical mid-density FPGA option for engineers who need a balance of logic, on-chip RAM and a high I/O count in a PQFP package. Its industrial temperature rating and RoHS compliance make it suitable for production systems that must operate reliably across extended temperature ranges.

For designs that leverage LatticeECP family capabilities—DSP blocks, flexible I/O standards and PLL-based clock management—this device provides a cost-conscious way to integrate logic, memory and interface functions while benefiting from the family’s design tool and IP ecosystem.

Request a quote or submit an RFQ to check pricing and availability for LFECP10E-4QN208I and to discuss lead times and ordering options.