LFECP10E-5FN256C

The LFECP10E-5FN256C is a LatticeECP-series FPGA providing a balanced mix of programmable logic, embedded memory, DSP resources and flexible I/O for mainstream embedded and communications applications. It implements approximately 10,200 logic elements and approximately 0.283 Mbits (282,624 bits) of on-chip RAM, with 195 I/Os in a 256-ball fpBGA (17 × 17 mm) package.

Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliance, this surface-mount device operates from a 1.14 V to 1.26 V core supply and integrates system-level features and development-tool support from the LatticeECP family.

Key Features

• Programmable Logic — Approximately 10,200 logic elements provide a flexible fabric for control, glue logic and moderate-density processing tasks.
• Embedded Memory — Approximately 282,624 bits of on-chip RAM support buffering, FIFOs and small embedded data structures.
• sysDSP Blocks — LatticeECP family integration includes sysDSP resources; the LFEC10/LFECP10 devices include 4 sysDSP blocks and support 18×18 multiplier configurations suited for multiply-accumulate workloads.
• Flexible I/O — 195 I/O pins in the 256-ball fpBGA package support a wide range of interfaces and board-level connections; programmable I/O buffers on the family support multiple signaling standards.
• Dedicated DDR Memory Support — Family-level DDR interface logic is provided to implement external memory interfaces (DDR support as described for the LatticeECP family).
• Clocking — Up to four analog PLLs per device (family specification) for clock multiplication, division and phase shifting.
• Package & Mounting — 256-FPBGA (17 × 17 mm) surface-mount package for compact, high-density board designs; 195-ball I/O count documented for this package option.
• Commercial Grade & Compliance — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Signal processing and DSP-based functions — sysDSP blocks and embedded memory support multiply-accumulate workloads and real-time filtering tasks.
• Memory interface and buffering — Built-in DDR memory support and on-chip RAM are suitable for designs requiring external SDRAM interfaces and internal buffering.
• Communications and protocol bridging — Flexible I/O and programmable logic enable protocol conversion, interface consolidation and custom transceiver logic.
• Embedded control and system glue — Logic density and I/O count make the device suitable for control tasks, peripheral aggregation and system orchestration in consumer and industrial products.

Unique Advantages

• Balanced integration: Combines thousands of logic elements with substantial on-chip RAM and DSP blocks to reduce external component count and simplify board design.
• Scalable DSP resources: sysDSP blocks and multiplier configurations enable efficient implementation of arithmetic-intensive functions without external accelerators.
• Flexible interface support: High I/O count in a compact 256-ball fpBGA package supports diverse signaling and multi-domain interfaces on a single device.
• System-level features: Multiple PLLs and family-level support for DDR memory facilitate synchronized, high-bandwidth system designs.
• Commercial readiness: Commercial temperature rating and RoHS compliance suit this device for mainstream electronics and production environments.

Why Choose LFECP10E-5FN256C?

The LFECP10E-5FN256C is positioned for developers who need a compact, commercially rated FPGA that balances logic capacity, embedded memory and DSP capability. Its 10,200 logic elements, substantial on-chip RAM and sysDSP resources support mid-range processing and interface tasks while the 195 I/Os and 256-ball fpBGA package enable dense board-level integration.

Supported by the LatticeECP family’s system features and development tool ecosystem, this device offers a practical combination of performance, integration and design flexibility for communications, embedded control, signal processing and other mainstream applications where cost-conscious, integrated FPGA solutions are required.

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