LFECP10E-4QN208C

IC FPGA 147 I/O 208QFP
Part Description

ECP Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP

Quantity 912 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFECP10E-4QN208C – ECP Field Programmable Gate Array (FPGA) IC, 147 I/O, 10,200 logic elements, 208-BFQFP

The LFECP10E-4QN208C is a Lattice Semiconductor ECP-family field programmable gate array (FPGA) supplied in a 208-pin BFQFP package. It provides mid-range logic capacity and embedded memory targeted at mainstream, cost-sensitive FPGA applications that benefit from integrated DSP and flexible I/O.

This device combines approximately 10,200 logic elements with 282,624 bits of on-chip RAM and 147 I/O pins, delivering a balance of logic, memory and I/O for embedded, DSP-enabled and memory-interface designs.

Key Features

  • Core architecture  LatticeECP FPGA fabric optimized for mainstream applications, combining LUT-based logic with dedicated high-speed functions.
  • Logic capacity  Approximately 10,200 logic elements to implement mid-range digital designs and control logic.
  • Embedded memory  282,624 total RAM bits (approximately 0.28 Mbits) of on-chip memory for buffering, frame storage and local data paths.
  • DSP resources (series-level)  Series-level LatticeECP DSP capability includes sysDSP blocks (4 blocks for the LFECP10 series) supporting 18×18 multiplier configurations for common multiply-accumulate tasks.
  • I/O and interface support  147 I/O pins; the LatticeECP family supports a broad range of programmable sysI/O buffer standards for flexible interfacing.
  • Clocking  Up to four analog PLLs per device (series-level) to enable clock multiply, divide and phase shifting.
  • Power  Supply voltage range 1.14 V to 1.26 V consistent with low-voltage FPGA system designs.
  • Package and mounting  208-BFQFP package (supplier package: 208-PQFP, 28 × 28 mm) for surface-mount assembly.
  • Operating conditions and compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Embedded systems  Implement control logic, glue-logic and custom peripheral interfaces with the device’s mid-range logic and flexible I/O.
  • DSP-accelerated processing  Offload multiply-accumulate and signal-processing tasks using the series-level sysDSP blocks and on-chip multipliers.
  • Memory interface and buffering  Use the on-chip RAM and dedicated DDR memory support at the series level to implement buffering and external memory interfaces.
  • Prototyping and product development  Fast-turn FPGA development for cost-sensitive products that require scalable logic, embedded memory and configurable I/O.

Unique Advantages

  • Balanced mid-range integration: Combines ~10,200 logic elements with substantial on-chip RAM to support logic-rich designs without excessive BOM complexity.
  • DSP-capable fabric: Series-level sysDSP blocks and multiplier resources provide a clear path for accelerating arithmetic-intensive functions.
  • Flexible interfacing: 147 I/O pins and LatticeECP programmable sysI/O support a wide set of interface standards for adaptable board-level integration.
  • Low-voltage operation: 1.14–1.26 V supply range supports low-power system architectures and modern power-rail designs.
  • Commercial temperature and RoHS compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance simplify regulatory and environmental considerations.
  • Package options for surface-mount assembly: 208-pin BFQFP/PQFP packaging provides a standard, manufacturable footprint for production designs.

Why Choose LFECP10E-4QN208C?

The LFECP10E-4QN208C is positioned for engineers who need a cost-effective, mid-density FPGA with integrated memory and DSP capabilities. Its combination of ~10,200 logic elements, sizeable on-chip RAM and 147 I/Os makes it suitable for mainstream embedded designs that require both logic and arithmetic acceleration.

Backed by the LatticeECP family architecture and its design-tool ecosystem, this device is a practical choice for teams developing scalable, cost-sensitive products that demand flexible I/O, dedicated DSP resources and standard commercial operating conditions.

Request a quote or submit an inquiry to get pricing and availability for the LFECP10E-4QN208C.

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