LFECP10E-5F484C

The LFECP10E-5F484C is an ECP architecture Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package for surface-mount assembly. It delivers a balance of programmable logic, embedded RAM, and I/O density for commercial-grade designs.

Designed for commercial applications, this device offers a combination of approximately 10,200 logic elements, about 0.28 Mbits of embedded memory, and 288 user I/Os, packaged in a 484-FPBGA (23×23) footprint with a nominal core supply range of 1.14 V to 1.26 V.

Key Features

• Core Logic Approximately 10,200 logic elements suitable for implementing custom combinational and sequential logic.
• Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 bits) for buffering, small FIFOs, and state storage.
• I/O Capacity 288 user I/Os to support multiple parallel interfaces and board-level connectivity.
• Power Supply Core voltage supply range from 1.14 V to 1.26 V to match system power-rail design requirements.
• Package & Mounting 484-ball BGA (484-FPBGA, 23×23) in a surface-mount package for compact board integration.
• Operating Range & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free board assembly.

Typical Applications

• Custom Logic and Glue-Logic Use the device’s ~10,200 logic elements and 288 I/Os to implement interface bridging, protocol adaptation, and board-level glue logic in commercial systems.
• Embedded Memory Functions Leverage approximately 0.28 Mbits of on-chip RAM for small buffering, lookup tables, or state machines in control and data-path functions.
• High-Density I/O Subsystems Deploy the 288 I/Os to consolidate multiple parallel interfaces and reduce external glue components in compact PCB layouts.

Unique Advantages

• Balanced Logic-to-Memory Ratio: Approximately 10,200 logic elements coupled with 282,624 bits of RAM provides flexible partitioning between compute and storage on-chip.
• High I/O Count: 288 user I/Os enable integration of multiple interfaces without sacrificing board-level connectivity options.
• Compact BGA Packaging: The 484-FPBGA (23×23) package supports a high-pin-density footprint while keeping board area efficient for surface-mount designs.
• Commercial-Grade Operating Range: Rated for 0 °C to 85 °C operation to align with standard commercial product lifecycles and environments.
• RoHS Compliant: Supports lead-free manufacturing and compliance requirements for commercial electronics.

Why Choose LFECP10E-5F484C?

The LFECP10E-5F484C positions itself as a commercially graded FPGA option that combines moderate programmable logic capacity, embedded memory, and a high I/O count in a compact 484-ball BGA package. Its specified core voltage range and RoHS compliance make it suitable for standard commercial product development and surface-mount production flows.

This device is well suited for designers seeking a scalable, integrated programmable logic element for applications that require a mix of logic, embedded RAM, and substantial I/O in a compact package, providing predictable electrical and thermal characteristics within the stated operating range.

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