LFECP10E-4F256C

The LFECP10E-4F256C is a commercial-grade ECP family FPGA from Lattice Semiconductor, delivering mid-range logic density and flexible I/O in a compact 256-ball fpBGA package. This device provides 10,200 logic elements, approximately 0.283 Mbits of embedded memory, and 195 user I/Os, making it suitable for designs that require significant on-chip logic and a broad set of interface pins within a small footprint.

Designed for system integration and embedded applications, the device operates from a 1.14 V to 1.26 V supply, is surface-mountable, and is specified for 0 °C to 85 °C commercial operation. It is RoHS compliant and packaged in a 256-FPBGA (17 × 17 mm) footprint for compact board designs.

Key Features

• Core Logic — 10,200 logic elements for implementing combinational and sequential logic, control functions and glue logic within a single device.
• Embedded Memory — Total on-chip RAM of 282,624 bits (approximately 0.283 Mbits) to support buffers, FIFOs and small on-chip data stores.
• I/O Resources — 195 user I/Os to support wide parallel interfaces, external peripherals, memory buses and board-level connectivity.
• Package & Mounting — 256-ball fpBGA package (256-FPBGA, 17 × 17 mm); surface-mount for reliable assembly in compact designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match targeted system power rails.
• Operating Range & Compliance — Commercial temperature grading from 0 °C to 85 °C and RoHS compliant.
• Family Capabilities (LatticeECP2/M) — The LatticeECP2/M family offers advanced system features such as sysDSP blocks, flexible embedded block RAM and distributed RAM configurations, programmable PLLs/DLLs for clock management, pre-engineered source-synchronous I/O support and flexible device configuration options (including SPI boot and dual boot images). Embedded SERDES and optional bitstream encryption are available in specific family variants.

Typical Applications

• Networking & Communications — Implement packet processing, protocol bridging or interface logic where multiple parallel and serial I/Os are required.
• Data Acquisition & Processing — Use the on-chip logic and embedded RAM to buffer and preprocess sensor or ADC/DAC data streams before passing to a host processor.
• Embedded Control & Glue Logic — Replace discrete logic and CPLDs with a single FPGA to consolidate control, timing and interfacing functions.
• Memory & Interface Bridging — Act as an interface hub between different buses or memory types, leveraging the device I/O count and on-chip memory.

Unique Advantages

• Balanced Logic Density: 10,200 logic elements enable substantial on-chip functionality without excessive power or board area.
• Significant On-Chip Memory: Approximately 0.283 Mbits of embedded RAM reduces dependency on external memory for buffering and temporary storage.
• High I/O Count: 195 I/Os provide flexibility for parallel interfaces, multi-channel connectivity and board-level integration.
• Compact Packaging: 256-FPBGA (17 × 17 mm) minimizes PCB footprint while retaining a large I/O complement for space-constrained designs.
• Design Ecosystem: Part of the LatticeECP2/M family, enabling access to family-level architecture and vendor design flows for efficient implementation and scaling.
• Commercial-Grade & RoHS Compliant: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial applications.

Why Choose LFECP10E-4F256C?

The LFECP10E-4F256C is positioned for engineers and teams seeking a mid-range FPGA that combines substantial logic capacity, embedded memory and a high I/O count within a compact fpBGA package. Its commercial temperature rating, RoHS compliance and surface-mount packaging make it suitable for a wide range of embedded and communications products that require reliable, compact programmable logic.

As a member of the LatticeECP2/M family, this device benefits from the family’s system-oriented features and vendor design tools, enabling scalable designs and smoother transitions to other family members when project requirements change.

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