LFECP10E-4FN256C

The LFECP10E-4FN256C is an ECP-series field programmable gate array (FPGA) optimized to deliver mainstream FPGA features for cost-sensitive designs. It combines a programmable logic fabric with dedicated DSP and memory resources from the LatticeECP family to address embedded and signal-processing applications.

With 10,200 logic elements, approximately 0.28 Mbits of on-chip RAM, and 195 I/Os in a 256-ball fpBGA (17 × 17 mm) package, this commercial-grade device targets mainstream applications requiring dense logic, flexible I/O, and embedded memory within a low-voltage core (1.14 V to 1.26 V).

Key Features

• Logic Capacity  Approximately 10,200 logic elements to implement complex glue logic, state machines, and control functions.
• Embedded Memory  Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) supporting distributed and block memories for buffering and local storage.
• DSP Resources  LatticeECP family sysDSP blocks and dedicated multipliers (family-level) enable hardware multiply-accumulate operations for signal-processing tasks.
• I/O Density & Flexibility  195 I/Os in a 256-ball fpBGA package provide broad interfacing capability for board-level peripherals and external memory.
• Clocking  Up to four analog PLLs (family-level) for clock multiply/divide and phase control, enabling flexible timing architectures.
• Low-Voltage Core  Core supply range of 1.14 V to 1.26 V for compatibility with low-voltage power domains.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C, suitable for commercial embedded environments.
• Package  256-ball fpBGA (17 × 17 mm) surface-mount package for compact board integration and higher pin density.
• Design Ecosystem  Supported by Lattice tools and ispLEVER design flow and ispLeverCORE IP modules (family-level) to accelerate development and integration.

Typical Applications

• Embedded Control Systems  Implements control logic, protocol handling, and system glue for commercial embedded products where compact board footprint and moderate temperatures are standard.
• Signal Processing  Uses on-chip sysDSP blocks and multipliers (family-level) for hardware-accelerated filtering, transforms, and other DSP functions.
• Memory Interface and Buffering  On-chip block and distributed RAM provide local buffering for memory interfaces and data stream management in DDR or external-memory systems (family-level DDR support documented).
• High-Pin-Count I/O Designs  Offers 195 I/Os for interfacing multiple peripherals, sensors, or board-level buses in compact fpBGA form factors.

Unique Advantages

• Balanced Logic and Memory  Combines ~10,200 logic elements with approximately 0.28 Mbits of embedded RAM to support mixed control and data-path functions on a single device.
• Dedicated DSP Capability  Family-level sysDSP blocks and multiplier resources enable efficient implementation of multiply-accumulate tasks without external accelerators.
• High I/O Count in a Compact Package  195 I/Os in a 17 × 17 mm 256-ball fpBGA reduce PCB area while preserving board-level connectivity.
• Low-Voltage Core  1.14 V to 1.26 V core supply supports integration into modern low-voltage power architectures.
• Commercial Temperature Suitability  Specified 0 °C to 85 °C operation aligns with commercial embedded product environments.
• Design and IP Support  Supported by the LatticeECP family design flow (ispLEVER) and pre-designed ispLeverCORE modules to accelerate time-to-market (family-level).

Why Choose LFECP10E-4FN256C?

The LFECP10E-4FN256C positions itself as a practical, low-voltage FPGA option within the LatticeECP family, offering a balance of logic density, embedded memory, DSP capability, and plentiful I/O in a compact 256-ball fpBGA package. Its combination of approximately 10,200 logic elements, on-chip RAM, and family-level DSP and clocking features makes it well suited to mainstream, cost-sensitive embedded and signal-processing designs.

Engineers seeking a commercially graded FPGA with a supported design ecosystem and options for density migration within the LatticeECP family will find this device appropriate for applications that require moderate temperature range, flexible interfacing, and integrated memory and DSP resources.

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