LFMXO5-25-7BBG400C

FPGA MACHXO5-NX W/FLASH 400BGA
Part Description

MachXO5-NX Field Programmable Gate Array (FPGA) IC 252 2187264 25000 400-LFBGA

Quantity 960 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O252Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3125Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2187264

Overview of LFMXO5-25-7BBG400C – MachXO5-NX FPGA — 25,000 logic elements, ~2.19 Mbits RAM, 252 I/O, 400-LFBGA

The LFMXO5-25-7BBG400C is a MachXO5-NX Field Programmable Gate Array (FPGA) IC delivering 25,000 logic elements and approximately 2.19 Mbits of embedded memory (2,187,264 total RAM bits). It is supplied in a 400-lead LFBGA package (400-CABGA, 17×17) in a surface-mount form factor and exposes up to 252 I/O pins.

As part of the MachXO5-NX family, the device is documented to include family-level capabilities such as programmable I/O, DDR memory support, on-chip oscillator and PLLs, system DSP and large RAM blocks, SGMII TX/RX, user flash memory (UFM), cryptographic engine, and IEEE 1149.1-compliant boundary scan, enabling compact system integration where embedded logic, memory and flexible I/O are required.

Key Features

  • Core Capacity — 25,000 logic elements for implementing medium-complexity programmable logic and custom control functions.
  • Embedded Memory — Approximately 2.19 Mbits (2,187,264 bits) of on-chip RAM to support frame buffers, FIFOs, and local data storage.
  • I/O Density — Up to 252 programmable I/O pins to support signal-rich designs and multiple peripheral interfaces.
  • Package & Mounting — 400-LFBGA (supplier device package: 400-CABGA, 17×17) surface-mount package for high-density board integration.
  • Power — Core supply operating range 0.95 V to 1.05 V, enabling predictable power budgeting for the core domain.
  • Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • System & Security Features — Family-level features documented in the datasheet include a cryptographic engine, user flash memory (UFM), IEEE 1149.1 boundary scan and device configuration options to support security and system provisioning.
  • Programmable I/O and Interface Support — Datasheet references programmable I/O cells, DDR memory support and hardened interfaces such as SGMII TX/RX and sysI/O building blocks for protocol and memory interfacing.
  • Compliance — RoHS compliant.

Typical Applications

  • Control and Glue Logic — Implement board-level control, sequencing and glue logic using the device’s 25,000 logic elements and 252 I/O to minimize external components.
  • Memory Interface and Data Buffering — Use on-chip RAM (approximately 2.19 Mbits) alongside documented DDR memory support for buffering, packet staging and local data storage.
  • Security and Configuration Management — Leverage the cryptographic engine and user flash memory (UFM) for secure configuration, key storage and device provisioning functions.
  • Protocol Bridging and High-density I/O — Implement protocol glue and bridging functions (including SGMII-capable blocks referenced in the datasheet) where multiple high-speed and general-purpose I/O are required.

Unique Advantages

  • High Logic and I/O Integration: 25,000 logic elements plus 252 I/O pins reduce the need for external glue logic and simplify board-level design.
  • Substantial On-Chip Memory: Approximately 2.19 Mbits of embedded RAM supports buffering and local data handling without immediate external memory.
  • Compact, High-density Packaging: 400-LFBGA (400-CABGA, 17×17) surface-mount package enables high-density PCB layouts while maintaining a large I/O count.
  • Documented Family-level Peripherals: MachXO5-NX family documentation lists programmable I/O, DDR support, SGMII, sysDSP and cryptographic features that help integrate complex system functions on-chip.
  • Predictable Power Envelope: A defined core supply range of 0.95–1.05 V aids power budgeting in multi-voltage systems.
  • Commercial Temperature Support: Rated for 0 °C to 85 °C operation to match commercial product environments and typical electronics applications.

Why Choose LFMXO5-25-7BBG400C?

The LFMXO5-25-7BBG400C provides a balanced combination of logic capacity, on-chip memory and high I/O count in a compact 400-LFBGA package, making it well suited for designs that require medium-complexity programmable logic with significant local RAM and flexible interfacing. Family-level capabilities documented in the datasheet — including programmable I/O, DDR memory support, cryptographic engine and on-chip configuration options — support integrated system functions and secure provisioning.

This commercial-grade MachXO5-NX device is appropriate for customers and designs prioritizing integration, predictable power planning and a documented set of programmable peripherals. Its combination of logic elements, memory and I/O density delivers long-term design scalability within the MachXO5-NX family and supports firmware-driven system refinement.

If you would like pricing or availability, request a quote or submit a purchase inquiry to begin the procurement process for the LFMXO5-25-7BBG400C.

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