LFMXO5-25-7BBG400C
| Part Description |
MachXO5-NX Field Programmable Gate Array (FPGA) IC 252 2187264 25000 400-LFBGA |
|---|---|
| Quantity | 960 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 252 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3125 | Number of Logic Elements/Cells | 25000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2187264 |
Overview of LFMXO5-25-7BBG400C – MachXO5-NX FPGA — 25,000 logic elements, ~2.19 Mbits RAM, 252 I/O, 400-LFBGA
The LFMXO5-25-7BBG400C is a MachXO5-NX Field Programmable Gate Array (FPGA) IC delivering 25,000 logic elements and approximately 2.19 Mbits of embedded memory (2,187,264 total RAM bits). It is supplied in a 400-lead LFBGA package (400-CABGA, 17×17) in a surface-mount form factor and exposes up to 252 I/O pins.
As part of the MachXO5-NX family, the device is documented to include family-level capabilities such as programmable I/O, DDR memory support, on-chip oscillator and PLLs, system DSP and large RAM blocks, SGMII TX/RX, user flash memory (UFM), cryptographic engine, and IEEE 1149.1-compliant boundary scan, enabling compact system integration where embedded logic, memory and flexible I/O are required.
Key Features
- Core Capacity — 25,000 logic elements for implementing medium-complexity programmable logic and custom control functions.
- Embedded Memory — Approximately 2.19 Mbits (2,187,264 bits) of on-chip RAM to support frame buffers, FIFOs, and local data storage.
- I/O Density — Up to 252 programmable I/O pins to support signal-rich designs and multiple peripheral interfaces.
- Package & Mounting — 400-LFBGA (supplier device package: 400-CABGA, 17×17) surface-mount package for high-density board integration.
- Power — Core supply operating range 0.95 V to 1.05 V, enabling predictable power budgeting for the core domain.
- Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- System & Security Features — Family-level features documented in the datasheet include a cryptographic engine, user flash memory (UFM), IEEE 1149.1 boundary scan and device configuration options to support security and system provisioning.
- Programmable I/O and Interface Support — Datasheet references programmable I/O cells, DDR memory support and hardened interfaces such as SGMII TX/RX and sysI/O building blocks for protocol and memory interfacing.
- Compliance — RoHS compliant.
Typical Applications
- Control and Glue Logic — Implement board-level control, sequencing and glue logic using the device’s 25,000 logic elements and 252 I/O to minimize external components.
- Memory Interface and Data Buffering — Use on-chip RAM (approximately 2.19 Mbits) alongside documented DDR memory support for buffering, packet staging and local data storage.
- Security and Configuration Management — Leverage the cryptographic engine and user flash memory (UFM) for secure configuration, key storage and device provisioning functions.
- Protocol Bridging and High-density I/O — Implement protocol glue and bridging functions (including SGMII-capable blocks referenced in the datasheet) where multiple high-speed and general-purpose I/O are required.
Unique Advantages
- High Logic and I/O Integration: 25,000 logic elements plus 252 I/O pins reduce the need for external glue logic and simplify board-level design.
- Substantial On-Chip Memory: Approximately 2.19 Mbits of embedded RAM supports buffering and local data handling without immediate external memory.
- Compact, High-density Packaging: 400-LFBGA (400-CABGA, 17×17) surface-mount package enables high-density PCB layouts while maintaining a large I/O count.
- Documented Family-level Peripherals: MachXO5-NX family documentation lists programmable I/O, DDR support, SGMII, sysDSP and cryptographic features that help integrate complex system functions on-chip.
- Predictable Power Envelope: A defined core supply range of 0.95–1.05 V aids power budgeting in multi-voltage systems.
- Commercial Temperature Support: Rated for 0 °C to 85 °C operation to match commercial product environments and typical electronics applications.
Why Choose LFMXO5-25-7BBG400C?
The LFMXO5-25-7BBG400C provides a balanced combination of logic capacity, on-chip memory and high I/O count in a compact 400-LFBGA package, making it well suited for designs that require medium-complexity programmable logic with significant local RAM and flexible interfacing. Family-level capabilities documented in the datasheet — including programmable I/O, DDR memory support, cryptographic engine and on-chip configuration options — support integrated system functions and secure provisioning.
This commercial-grade MachXO5-NX device is appropriate for customers and designs prioritizing integration, predictable power planning and a documented set of programmable peripherals. Its combination of logic elements, memory and I/O density delivers long-term design scalability within the MachXO5-NX family and supports firmware-driven system refinement.
If you would like pricing or availability, request a quote or submit a purchase inquiry to begin the procurement process for the LFMXO5-25-7BBG400C.

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