LFMXO5-25-7BBG400I

FPGA MACHXO5-NX W/FLASH 400BGA
Part Description

MachXO5-NX Field Programmable Gate Array (FPGA) IC 252 2187264 25000 400-LFBGA

Quantity 1,702 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-LFBGANumber of I/O252Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3125Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2187264

Overview of LFMXO5-25-7BBG400I – MachXO5‑NX FPGA, 25,000 logic elements, 252 I/Os, 400‑LFBGA

The LFMXO5-25-7BBG400I is a MachXO5‑NX family Field Programmable Gate Array (FPGA) IC optimized for mid‑density embedded designs. It integrates 25,000 logic elements with a high I/O count and substantial on‑chip memory to address interface, control and system integration tasks in industrial environments.

Designed for low‑voltage operation and extended temperature ranges, this device is suited for applications that require reliable I/O density, embedded memory and system features such as programmable I/O, cryptographic support and on‑chip configuration resources.

Key Features

  • Core Logic — 25,000 logic elements for mid‑density FPGA implementations and flexible design partitioning.
  • Embedded Memory — Approximately 2.19 Mbits of on‑chip RAM to support buffering, tables and local storage for logic functions.
  • I/O and Interfaces — 252 user I/Os and programmable I/O cells; datasheet references include support for SGMII TX/RX and DDR memory interfaces.
  • Power and Package — Low‑voltage supply range of 0.95 V to 1.05 V and supplied in a 400‑LFBGA package (supplier package: 400‑CABGA, 17×17 mm) for compact system integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial deployment.
  • System and Security Blocks — Datasheet lists integrated system features including a cryptographic engine, on‑chip oscillator, User I²C IP and User Flash Memory (UFM) for configuration and secure storage.
  • Design and Test Support — Family documentation includes IEEE 1149.1‑compliant boundary scan, JTAG and pin migration features to simplify board bring‑up and testing.
  • Reliability Features — Device-level capabilities in the family include Single Event Upset (SEU) support and configurable device configuration mechanisms.

Typical Applications

  • Interface Bridging and Protocol Conversion — High I/O count combined with SGMII and DDR interface support enables implementation of protocol bridges and front‑end interface logic.
  • Industrial Control and Automation — Extended −40 °C to 100 °C operating range and industrial grade qualification make the device suitable for factory automation, motion control and machine I/O aggregation.
  • Security and Configuration — On‑chip cryptographic engine and User Flash Memory (UFM) provide hardware resources for device authentication, secure boot and protected configuration storage.
  • Memory‑Centric Functions — Approximately 2.19 Mbits of embedded RAM and sysMEM/large RAM blocks (as described in the family datasheet) support buffering, packet processing and local data storage.

Unique Advantages

  • High Logic Density with Compact Footprint: 25,000 logic elements in a 400‑LFBGA package enables substantial logic integration without a large PCB area impact.
  • Generous I/O Resources: 252 I/Os provide flexibility for multi‑protocol interfacing, sensor and peripheral connectivity, or parallel bus implementations.
  • Low‑Voltage Operation: Nominal supply range of 0.95 V to 1.05 V supports low‑power system architectures and consistent power budgeting.
  • Industrial Reliability: Specified industrial operating temperature (−40 °C to 100 °C) and RoHS compliance make the part suitable for deployed industrial systems.
  • Integrated System IP: Family features such as cryptographic engine, on‑chip oscillator, User I²C and UFM reduce external component count and simplify system design.
  • Design and Testability: Boundary scan (IEEE 1149.1), JTAG and pin migration support from the MachXO5‑NX family streamline prototyping, production testing and board rework.

Why Choose LFMXO5-25-7BBG400I?

The LFMXO5‑25‑7BBG400I delivers a balanced combination of logic capacity, on‑chip memory and high I/O density in a low‑voltage, industrial‑grade package. As a member of the MachXO5‑NX family, it provides system designers with embedded system features—security blocks, configuration storage and interface support—documented in the family datasheet to simplify implementation and reduce external components.

This device is a fit for engineering teams building mid‑density FPGA solutions that require robust I/O, embedded memory resources and industrial temperature operation, offering a clear hardware platform for interface centric and control applications.

Request a quote or contact our sales team to discuss availability, lead times and pricing for the LFMXO5-25-7BBG400I.

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