LFMXO5-25-8BBG400I

The LFMXO5-25-8BBG400I is a field programmable gate array (FPGA) from the MachXO5‑NX family by Lattice Semiconductor. It provides 25,000 logic elements, approximately 2.19 Mbits of embedded RAM, and up to 252 I/Os in a 400‑LFBGA package for compact, high-density designs.

Designed for industrial-grade applications, this surface-mount device supports a core supply range of 0.95 V to 1.05 V and an operating temperature range of -40°C to 100°C, making it suitable where extended temperature stability and integration density are required.

Key Features

• Logic Capacity — 25,000 logic elements (logic cells) suitable for complex glue logic, protocol bridging, and mid-range FPGA functions.
• Embedded Memory — Total on-chip RAM of 2,187,264 bits (approximately 2.19 Mbits) to support buffering, FIFOs, and small on-chip data storage.
• I/O Resources — Up to 252 I/Os for high pin-count designs; programmable I/O and sysI/O capabilities are included at the family level.
• Package & Mounting — 400‑LFBGA package (supplier device package: 400‑CABGA, 17×17) in a surface-mount form factor for space-efficient board layouts.
• Power — Core supply operating range 0.95 V to 1.05 V for low-voltage system integration.
• Thermal & Grade — Industrial grade with specified operating temperature from -40°C to 100°C for extended environment use.
• Family-Level Features — MachXO5‑NX family capabilities include programmable I/O cells, DDR memory support, sysCLOCK PLLs, on‑chip oscillator, user flash memory (UFM), cryptographic engine, IEEE 1149.1 boundary-scan testability, and single-event upset (SEU) support, as described in the MachXO5‑NX datasheet.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Consolidate glue logic and I/O routing in control systems using the device’s 25,000 logic elements and 252 I/Os across the industrial temperature range.
• Interface Bridging — Implement protocol conversion and bus interfacing leveraging programmable I/O and on‑chip memory resources.
• Secure System Functions — Integrate security features available at the family level (cryptographic engine and UFM) for protected configuration and secure key storage.
• Memory-Enabled Design — Use the embedded RAM (~2.19 Mbits) and DDR support (family-level) for buffering, packet handling, and intermediate data storage.

Unique Advantages

• High Logic and I/O Density: 25,000 logic elements and 252 I/Os provide the capacity to replace multiple discrete components and reduce board complexity.
• Industrial Temperature Range: Specified -40°C to 100°C operation supports deployment in demanding environmental conditions.
• Compact Packaging: 400‑LFBGA / 400‑CABGA (17×17) enables high functional density in space-constrained assemblies.
• Integrated Memory Resources: Approximately 2.19 Mbits of on‑chip RAM reduces reliance on external memory for moderate buffering and state storage.
• Family-Level System Features: Family documentation cites programmable I/O, PLLs, on‑chip oscillator, cryptographic engine, and UFM—enabling system integration and advanced functions without external components.
• Regulatory Compliance: RoHS compliance facilitates use in modern electronics manufacturing flows.

Why Choose LFMXO5-25-8BBG400I?

The LFMXO5-25-8BBG400I positions itself as a versatile mid-range MachXO5‑NX FPGA offering a balance of logic capacity, embedded memory, and I/O density in a compact BGA package. Its industrial operating range and surface-mount 400‑LFBGA footprint make it a practical choice for designers needing to consolidate logic, implement interface bridging, or add security-oriented functionality without increasing board area.

Backed by MachXO5‑NX family capabilities documented in the datasheet—such as programmable I/O, memory support, and system-level utilities—this device is suited for engineering teams seeking scalability, integration, and robust operation across extended temperature conditions.

Request a quote or submit a product inquiry today to learn how LFMXO5-25-8BBG400I can fit into your design and sourcing plans.