LFMXO5-25-9BBG400C

The LFMXO5-25-9BBG400C is a MachXO5-NX family Field Programmable Gate Array (FPGA) in a 400-LFBGA (400-CABGA, 17×17) package. This commercial-grade device provides 25,000 logic elements, approximately 2.19 Mbits of embedded RAM (2,187,264 bits) and 252 general-purpose I/O pins, making it suitable for mid-density programmable logic tasks in commercial electronic systems.

With a low-voltage core supply range (0.95 V to 1.05 V), surface-mount packaging and an operating temperature range of 0 °C to 85 °C, this MachXO5-NX device targets system control, I/O expansion and interface integration where compact packaging and a balanced mix of logic, memory and I/O are required.

Key Features

• Core Logic — 25,000 logic elements to implement glue logic, control FSMs and mid-density custom logic functions.
• Embedded Memory — Approximately 2.19 Mbits (2,187,264 bits) of on-chip RAM for data buffering, FIFOs and local storage.
• High I/O Count — 252 I/O pins to support dense peripheral interfacing and multi-channel signal connectivity.
• Power and Voltage — Core supply specified from 0.95 V to 1.05 V to match system power rails and support predictable core operation.
• Package & Mounting — 400-LFBGA (400-CABGA, 17×17) surface-mount package suited for board-level integration in space-constrained designs.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Regulatory — RoHS compliant for environmental and manufacturing compatibility.
• MachXO5-NX Family Capabilities — The MachXO5-NX datasheet documents family-level features such as programmable I/O cells, DDR memory support, SGMII TX/RX blocks, sysDSP and sysMEM blocks, on-chip oscillator, user I²C IP, user flash memory (UFM), cryptographic engine options, boundary scan and configuration/SEU management features.

Typical Applications

• System Control & Glue Logic — Implement board-level control, sequencing and interfacing between processors, peripherals and custom logic.
• Interface Bridging — Provide protocol adaptation and high-density I/O mapping for peripherals and subsystems.
• Embedded Memory Buffering — Use on-chip RAM for data buffering, temporary storage and FIFO implementations in communication or data-acquisition paths.
• Compact Commercial Electronics — Integrate mid-density programmable logic into space-constrained commercial devices that require a balance of logic, memory and I/O.

Unique Advantages

• Mid-density logic with significant memory: 25,000 logic elements combined with ~2.19 Mbits of RAM support a broad set of control and buffering tasks without external memory.
• High I/O integration: 252 I/O pins reduce the need for additional interface components and simplify board routing for complex peripheral sets.
• Compact, industry-standard package: 400-LFBGA (17×17) surface-mount package enables dense PCB layouts while maintaining robust connectivity.
• Predictable power domain: Narrow core voltage range (0.95–1.05 V) helps streamline power-supply design and margin planning.
• Commercial temperature rating and RoHS compliance: Supports mainstream commercial deployments with environmental compliance for manufacturing.
• Family-level system features: MachXO5-NX family capabilities documented in the datasheet (programmable I/O, DDR support, SGMII, cryptography, UFM, etc.) provide a flexible foundation for diverse designs.

Why Choose LFMXO5-25-9BBG400C?

The LFMXO5-25-9BBG400C positions itself as a versatile mid-density FPGA option for commercial applications that require a balanced combination of logic resources, embedded memory and extensive I/O. Its 25,000 logic elements and approximately 2.19 Mbits of on-chip RAM reduce dependency on external components, while the 252 I/Os enable rich peripheral connectivity in a compact 400-LFBGA footprint.

Designed as part of the MachXO5-NX family, this device benefits from a documented set of system-level features (programmable I/O cells, memory and interface building blocks, security and configuration options) that help accelerate integration and reduce overall system complexity for embedded and interface-focused designs.

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