LFMXO5-25-9BBG256C

The LFMXO5-25-9BBG256C is a MachXO5‑NX family Field Programmable Gate Array (FPGA) IC designed for commercial embedded applications that require flexible programmable logic and on-chip memory. Built on the MachXO5‑NX architecture, this device balances a high logic element count with significant embedded RAM and a broad I/O complement to address glue logic, interface bridging, and system-control tasks.

With 25,000 logic elements, approximately 2.19 Mbits of embedded RAM and 160 I/O pins in a compact 256‑LFBGA package, the device targets designers needing a low-voltage, surface‑mount FPGA option for mainstream electronic products operating across a commercial temperature range.

Key Features

• Logic Capacity — 25,000 logic elements suitable for complex glue logic, state machines and mid‑density programmable logic functions.
• Embedded Memory — Approximately 2.19 Mbits (2,187,264 bits) of on‑chip RAM for data buffering, FIFOs and local storage.
• I/O Density — 160 programmable I/O pins to support multiple interfaces and board-level connectivity.
• Package & Mounting — 256‑LFBGA (supplier package: 256‑CABGA, 14×14) in a surface‑mount format for compact board integration.
• Low‑Voltage Core — Core supply range 0.95 V to 1.05 V to match low‑voltage system designs.
• Commercial Grade & Temperature — Commercial grade device with operating temperature from 0 °C to 85 °C.
• Compliance — RoHS‑compliant.
• Family Features (MachXO5‑NX) — Series documentation indicates support for programmable I/O cells, on‑chip oscillator, user flash memory (UFM), cryptographic engine, sysDSP and various memory/interface building blocks—enabling a wide range of system functions when implemented within the family architecture.

Typical Applications

• Commercial Embedded Systems — Implement system control, custom glue logic and protocol conversion in general‑purpose embedded products operating within commercial temperature ranges.
• Communications & Networking — Use the device’s I/O density and MachXO5‑NX family interface building blocks for interface bridging, buffering and control in network equipment.
• User Interface & Control — Drive display controllers, keypad scanning and board-level control functions where programmable logic and on‑chip RAM simplify design.
• Memory Interface & Buffering — Employ embedded RAM and logic resources for local buffering, FIFO management and temporary data storage in multi‑component systems.

Unique Advantages

• High Logic Density: 25,000 logic elements provide headroom for moderate to complex designs without moving to a larger device family.
• Significant On‑Chip RAM: Approximately 2.19 Mbits of embedded memory reduces external memory needs and simplifies board routing.
• Flexible I/O Count: 160 I/Os enable multiple parallel interfaces and mixed‑signal connectivity options on a single chip.
• Compact BGA Package: 256‑LFBGA (14×14) surface‑mount package minimizes PCB footprint while supporting high pin count implementations.
• Low‑Voltage Operation: 0.95 V to 1.05 V supply range aligns with modern low‑voltage core environments to optimize power delivery.
• Commercial‑Grade Availability: Designed for mainstream commercial products with RoHS compliance for regulatory alignment.

Why Choose LFMXO5-25-9BBG256C?

The LFMXO5‑25‑9BBG256C positions itself as a versatile MachXO5‑NX family FPGA for commercial embedded designs that require a balance of logic resources, on‑chip memory and a substantial I/O footprint in a compact BGA package. It is well suited to engineers who need programmable logic to implement interface bridging, control functions and local buffering while maintaining a small PCB footprint and low core voltage.

Backed by the MachXO5‑NX family documentation, this part offers designers predictable specifications for logic, memory and I/O that simplify component selection and integration into long‑lifecycle commercial products.

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