LFMXO5-25-8BBG256C

The LFMXO5-25-8BBG256C is a MachXO5‑NX family Field Programmable Gate Array (FPGA) offered in a 256‑LFBGA package. It integrates approximately 25,000 logic elements, roughly 2.19 Mbits of embedded memory, and up to 160 programmable I/Os to address mid-density logic, control, and interface functions in commercial electronics.

Designed for applications requiring configurable logic, memory and I/O integration in a compact surface‑mount package, this device operates from a 0.95 V to 1.05 V core supply and is rated for commercial temperatures (0 °C to 85 °C). It is RoHS compliant.

Key Features

• Logic Capacity — Approximately 25,000 logic elements for implementing mid-density programmable logic, state machines and glue logic.
• Embedded Memory — Approximately 2.19 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O Count & Programmability — 160 I/Os, providing flexible signal interfacing and broad connectivity for peripherals and external devices.
• Package & Mounting — 256‑LFBGA (256‑CABGA, 14×14) surface‑mount package for compact board integration.
• Power & Voltage — Core supply range of 0.95 V to 1.05 V, enabling low‑voltage operation consistent with modern system power domains.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C suitable for consumer and general industrial applications.
• System IP & Peripherals (family-level) — MachXO5‑NX family datasheet documents include features such as programmable I/O cells, DDR memory support, SGMII TX/RX, on‑chip oscillator, user flash memory (UFM), cryptographic engine, ADC/analog interfaces and boundary‑scan testability.
• Standards & Compliance — RoHS compliant, supporting environmentally responsible designs.

Typical Applications

• Networking & Connectivity — Leveraging documented SGMII and programmable I/O features in the MachXO5‑NX family for control, interface bridging and link management.
• Memory Interface & Glue Logic — Use as a controller or interface fabric where DDR support and embedded RAM enable local buffering and protocol adaptation.
• Sensor & Analog Front‑Ends — Family‑documented analog interface and ADC resources make this device suitable for sensor aggregation, preprocessing and monitoring tasks.
• System Control & Configuration — High I/O count and on‑chip UFM support configuration storage, system supervision and user interface control logic.
• Security & Authentication — Family cryptographic engine and configuration features support secure boot/configuration and authenticated firmware storage.

Unique Advantages

• High logic density in a compact package: Approximately 25,000 logic elements in a 256‑LFBGA footprint reduces board area while supporting complex designs.
• Substantial on‑chip memory: Approximately 2.19 Mbits of embedded RAM lowers dependence on external memory for buffering and state storage.
• Flexible connectivity: 160 programmable I/Os provide broad interface options for peripherals, sensors and external interfaces.
• Low‑voltage core operation: 0.95 V to 1.05 V supply range aligns with modern low‑voltage system architectures.
• Family‑level system IP: MachXO5‑NX family documentation includes features such as DDR support, SGMII, on‑chip oscillator, UFM and cryptographic engine for integrated system functionality.
• RoHS compliant and surface‑mount ready: 256‑LFBGA surface‑mount package and RoHS compliance simplify manufacturing and regulatory alignment.

Why Choose LFMXO5-25-8BBG256C?

The LFMXO5‑25‑8BBG256C combines mid‑density programmable logic, significant embedded memory and a high I/O count in a compact 256‑LFBGA package, making it well suited for designs that require integration of control, interface and preprocessing functions without large external component counts. Its documented MachXO5‑NX family features—such as programmable I/O, memory interfaces, system peripherals and security primitives—provide designers with a broad set of building blocks for commercial applications.

This device is a practical choice for embedded system designers, hardware engineers and OEMs who need scalable MachXO5‑NX family capability with verifiable electrical and environmental specifications (0.95–1.05 V core, 0 °C to 85 °C, surface‑mount 256‑LFBGA). The combination of on‑chip resources and family‑level system IP can help reduce BOM complexity and streamline board design.

If you require pricing, availability or assistance evaluating the LFMXO5-25-8BBG256C for your design, request a quote or submit an inquiry to obtain detailed purchasing information and lead‑time estimates.