LFMXO5-25-8BBG400C

FPGA MACHXO5-NX W/FLASH 400BGA
Part Description

MachXO5-NX Field Programmable Gate Array (FPGA) IC 252 2187264 25000 400-LFBGA

Quantity 267 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-LFBGANumber of I/O252Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3125Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2187264

Overview of LFMXO5-25-8BBG400C – MachXO5-NX FPGA, 25,000 logic elements, 400‑LFBGA

The LFMXO5-25-8BBG400C is a MachXO5‑NX family field programmable gate array provided in a 400‑LFBGA (400‑CABGA, 17×17) surface‑mount package. It integrates 25,000 logic elements and high I/O density to address glue‑logic, control and connectivity roles in commercial electronic equipment.

Built around the MachXO5‑NX family architecture, the device combines logic, embedded memory and system features such as on‑chip oscillators, programmable I/O and security/capability blocks to simplify system integration while operating from a low core voltage (0.95–1.05 V).

Key Features

  • Logic Capacity  25,000 logic elements (logic element cells) to implement glue logic, state machines and moderate combinational/sequential logic functions.
  • Embedded Memory  Approximately 2.19 Mbits of on‑chip RAM for buffering, FIFOs and configuration storage needs.
  • I/O Density  252 user I/O pins to support high‑pincount interfaces and parallel buses in a single device.
  • Supply Voltage  Low‑voltage core operation from 0.95 V to 1.05 V to match modern low‑voltage power rails.
  • Package & Mounting  400‑LFBGA (400‑CABGA, 17×17) package, surface mount mounting for compact PCB designs.
  • Operating Range  Commercial temperature rating: 0 °C to 85 °C for general‑purpose commercial applications.
  • System & Integration Blocks  Family documentation lists on‑chip oscillator, programmable I/O cells, DDR memory support, sysDSP and sysI/O buffers to aid system design and reduce external components.
  • Security & Configuration  Family features include user flash memory (UFM), cryptographic engine and boundary‑scan capabilities for configuration, security and test support.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • Embedded control and system glue  Implement command and control logic, peripheral interfaces and protocol bridging where dense I/O and moderate logic capacity are required.
  • Communications and networking endpoints  Support interface aggregation, packet buffering and control path logic using the device’s I/O density and embedded memory.
  • Consumer and commercial electronics  Drive display controllers, user interface logic and peripheral management in compact, low‑voltage designs.
  • Security and authentication modules  Leverage on‑chip flash and cryptographic engine features for local authentication and secure configuration storage.

Unique Advantages

  • Highly integrated logic and memory: 25,000 logic elements combined with approximately 2.19 Mbits of embedded RAM reduce external component needs for common buffering and control tasks.
  • High I/O pin count: 252 I/O pins allow consolidation of multiple interfaces and simplify board‑level routing in dense designs.
  • Low core voltage operation: 0.95–1.05 V supply compatibility aligns with modern low‑voltage power domains and helps optimize system power architecture.
  • Compact surface‑mount package: 400‑LFBGA (17×17) offers a small footprint for space‑constrained PCBs while preserving thermal and connection density.
  • Built‑in system features: Family features such as programmable I/O cells, on‑chip oscillator, DDR support and sysDSP blocks help reduce BOM and speed development.
  • Commercial temperature rating and RoHS compliance: Ready for deployment in commercial equipment with environmental compliance for manufacturing.

Why Choose LFMXO5-25-8BBG400C?

The LFMXO5-25-8BBG400C positions itself as a versatile, mid‑capacity MachXO5‑NX FPGA suitable for designers who need a balance of logic capacity, on‑chip memory and high I/O density in a compact surface‑mount package. Its low core voltage operation and integrated family features streamline power and system design while reducing external components.

This part is well suited to teams building commercial‑grade equipment that require reliable programmable logic for interface bridging, control functions, buffering and secure configuration storage, backed by the MachXO5‑NX family documentation and system feature set.

If you would like a price or availability quote, request one now or submit an inquiry to get more information and lead‑time details for LFMXO5-25-8BBG400C.

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