LFMXO5-25-9BBG256I

The LFMXO5-25-9BBG256I is a MachXO5-NX family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. This device provides 25,000 logic elements, approximately 2.187 Mbits of embedded memory, and 160 user I/O pins in a compact 256‑LFBGA (256‑CABGA, 14×14) package.

Built for industrial-grade applications, this FPGA supports a 0.95 V–1.05 V core supply and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require dense programmable logic, on-chip memory, and extensive I/O in a surface-mount package.

Key Features

• Core Logic — 25,000 logic elements to implement complex, configurable logic and glue functions.
• Embedded Memory — Approximately 2.187 Mbits of on-chip RAM for buffering, packet storage, and data processing.
• I/O Resources — 160 user I/O pins and programmable I/O support for flexible interfacing.
• Package & Mounting — 256‑LFBGA package (supplier package: 256‑CABGA, 14×14), surface mount mounting type for compact board integration.
• Power — Core supply voltage range: 0.950 V to 1.050 V for low-voltage operation.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C.
• MachXO5‑NX Family Capabilities — As part of the MachXO5‑NX family (datasheet references), the architecture includes programmable I/O, DDR memory support, sysDSP blocks, on-chip oscillator, cryptographic engine, boundary-scan (JTAG), and embedded user flash (UFM).
• Standards & Testability — Family-level features listed in the datasheet include IEEE 1149.1‑compliant boundary-scan testability and configuration/trace capabilities.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial control and automation — Industrial grade temperature range and robust I/O count enable reliable control, monitoring, and glue logic in industrial systems.
• Interface consolidation and bridging — Large I/O complement and programmable I/O support make the device suitable for consolidating multiple interfaces or implementing protocol bridges.
• Embedded buffering and data handling — Approximately 2.187 Mbits of embedded RAM supports on-chip buffering, FIFOs, and temporary data storage for real-time processing.

Unique Advantages

• High integration density: 25,000 logic elements reduce external glue logic and simplify board-level design.
• Substantial on-chip memory: Approximately 2.187 Mbits of RAM supports local buffering and data path storage without external memory.
• Extensive I/O flexibility: 160 user I/Os and MachXO5‑NX family programmable I/O enable flexible interfacing with peripherals and sensors.
• Industrial readiness: Rated for −40 °C to 100 °C operation and specified as industrial grade for demanding environments.
• Compact surface-mount package: 256‑LFBGA (256‑CABGA, 14×14) provides a space-efficient footprint for dense PCBs.
• Low-voltage core operation: 0.95 V–1.05 V supply supports lower power core operation where applicable.

Why Choose LFMXO5-25-9BBG256I?

The LFMXO5-25-9BBG256I positions itself as a flexible, industrial-grade FPGA option within the MachXO5‑NX family, offering a balance of logic capacity, embedded memory, and I/O density in a compact surface-mount package. Its family-level architecture (including programmable I/O, sysDSP, DDR support, and on-chip system features referenced in the datasheet) provides a versatile foundation for embedded designs that require integrated logic, buffering, and interface consolidation.

This device is well suited for designers seeking a scalable, robust FPGA solution for industrial and embedded applications where temperature range, I/O count, and on-chip memory are key selection criteria.

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