LFMXO5-25-8BBG256I

The LFMXO5-25-8BBG256I is a Field Programmable Gate Array (FPGA) device in the MachXO5‑NX family from Lattice Semiconductor. It integrates up to 25,000 logic elements with approximately 2.19 Mbits of on‑chip RAM and provides 160 I/O pins in a 256‑ball LFBGA package.

With an industrial operating range of −40 °C to 100 °C and a core supply range of 0.95 V to 1.05 V, this device targets designs that require mid‑density programmable logic, substantial embedded memory, and robust I/O capability in a compact package.

Key Features

• Core Logic — 25,000 logic elements for implementing custom digital logic, state machines, and glue functions.
• Embedded Memory — Approximately 2.19 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage.
• I/O Count — 160 programmable I/O pins to interface with multiple peripherals and external devices.
• Power — Core voltage supply range of 0.95 V to 1.05 V to match low‑voltage system rails.
• Package — 256‑LFBGA (supplier device package: 256‑CABGA, 14×14) for a high‑density, surface‑mount footprint.
• Industrial Grade Operation — Specified operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• Family Support — Part of the MachXO5‑NX family, with datasheet and family architecture details available for system planning and device selection.

Typical Applications

• Industrial Control and I/O — The industrial temperature range (−40 °C to 100 °C) and 160 I/Os make this device suitable for control and monitoring applications that require reliable I/O connectivity.
• Embedded Logic and Glue — Up to 25,000 logic elements enable implementation of glue logic, protocol bridging, and custom control functions within embedded systems.
• Memory‑Assisted Data Handling — Approximately 2.19 Mbits of embedded RAM supports local buffering, FIFO implementations, and small shared memory requirements.

Unique Advantages

• Mid‑density programmable logic: 25,000 logic elements provide a balance between capability and cost for many embedded designs.
• Substantial on‑chip RAM: Approximately 2.19 Mbits of embedded memory reduces dependency on external memory for many data buffering tasks.
• High I/O count in a compact package: 160 I/Os in a 256‑LFBGA package enable dense connectivity while conserving PCB area.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Low‑voltage core: Operates with a core supply between 0.95 V and 1.05 V to align with modern low‑voltage power rails.

Why Choose LFMXO5-25-8BBG256I?

The LFMXO5-25-8BBG256I delivers a practical combination of logic capacity, embedded memory, and extensive I/O in a compact 256‑LFBGA package. As a member of the MachXO5‑NX family, it offers a consistent architectural foundation for scaling designs across similar devices.

This device is well suited to engineers and procurement teams seeking a robust, industrial‑rated FPGA option that supports mid‑density logic implementations, on‑chip memory for buffering, and flexible I/O for interfacing needs—providing a clear tradeoff between integration, board space, and performance for embedded and industrial applications.

Request a quote or submit an inquiry to receive pricing and availability information for the LFMXO5-25-8BBG256I.